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Semiconductor equipment suppliers build the specialized machines and provide the services used to make and package chips. ASML is best known for lithography and related wafer-fab measurement and inspection systems; Besi supplies equipment for assembling and packaging semiconductor dies. Their work meets around advanced packaging and 3D integration, but the companies primarily serve different production stages.
Where equipment suppliers fit in chip production
Chipmakers use equipment from specialist suppliers at different stages of production. Some tools help create patterned structures on a wafer; others measure or inspect those structures. After wafer fabrication, assembly equipment attaches and connects dies and helps turn them into packaged components. This is a simplified map, not a complete manufacturing flow: semiconductor production involves many additional processes and suppliers.
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ASML describes its offering as hardware, software and services that help chipmakers manufacture microchips. Besi describes itself as an assembly-equipment manufacturer serving the semiconductor and electronics industries. The companies are therefore useful examples of distinct roles in a much larger supply chain.
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ASML: lithography and wafer-fab systems
ASML’s core role is in wafer fabrication. Its portfolio includes extreme ultraviolet (EUV) and deep ultraviolet (DUV) lithography systems, along with metrology and inspection equipment. Lithography uses light to transfer patterns onto a wafer; metrology and inspection systems help measure and examine the result. ASML’s annual report describes EUV and DUV as parts of its lithography portfolio and identifies related measurement and inspection systems as well. ASML 2025 Annual Report
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EUV and DUV in context
ASML says EUV lithography uses light with a wavelength of 13.5 nanometers. That is the wavelength of the light used by the system, not a universal measurement of chip features. ASML describes generating EUV light through a laser-produced plasma process and using multilayer mirrors developed with optical partner ZEISS to guide it. DUV remains part of ASML’s portfolio and can be used with multi-patterning to produce small features. ASML: Strategy & stories
ASML’s 2025 system sales
For 2025, ASML reported 535 system sales: 48 EUV lithography systems, 279 DUV lithography systems, and 208 metrology and inspection systems. These are ASML’s own figures, not a count of all semiconductor equipment sold across the industry. The company also reported 2025 total net sales of €32.7 billion, a 52.8% gross margin and €4.7 billion in research and development investment; those financial figures are ASML-reported US GAAP figures. ASML 2025 Annual Report Based on US GAAP
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Besi: assembly and packaging equipment
Besi’s equipment supports semiconductor assembly and packaging rather than ASML’s main wafer-patterning role. Its product range includes tools for attaching dies, joining them to substrates or other dies, and finishing packages. Besi lists single-chip and multi-chip die attach, flip-chip, thermal-compression bonding, fan-out wafer-level packaging, hybrid bonding and embedded-bridge die bonding among its die-attach offerings. Its other product groups include molding, trim and form, singulation, and tin, copper and precious-metal plating. Besi: Products & Services
Besi also lists tooling, conversion kits, spare parts and services for customers using its equipment. This matters because equipment suppliers’ role can continue beyond the initial sale: their installed tools may require support and parts as production needs change.
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How ASML and Besi compare
| Comparison | ASML | Besi |
|---|---|---|
| Primary production stage | Wafer fabrication, especially lithography and related metrology and inspection | Assembly and packaging of semiconductor dies |
| Examples of equipment | EUV and DUV lithography; metrology and inspection systems | Die attach, flip-chip and bonding; molding, singulation and plating |
| Customer context | Chipmakers operating wafer-fabrication processes | Semiconductor and electronics assembly operations, including customers using Besi’s installed equipment |
| Advanced-packaging connection | Shipped its first advanced-packaging product, TWINSCAN XT:260, in 2025 | Lists hybrid and embedded-bridge bonding equipment among its offerings |
The comparison is about production stage and equipment function, not a price or performance ranking. The companies’ portfolios are not interchangeable: ASML’s established lithography and metrology role differs from Besi’s assembly and packaging focus.
Why packaging and wafer fabrication are becoming more connected
Advanced packaging can connect multiple dies or wafers, including in stacked configurations. ASML describes wafer bonding as joining separate wafers—for example, logic and memory—into a stack. It also says lithography, metrology and inspection can support the precision needed for bonded wafers. Besi’s hybrid and embedded-bridge bonding tools are examples of assembly equipment used in this adjacent area. These examples show why wafer-fab and packaging suppliers can serve connected parts of production without performing the same step. ASML: Strategy & stories Besi: Products & Services
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ASML’s first shipment of its advanced-packaging product, TWINSCAN XT:260, in 2025 marks an expansion into this area. It does not erase the distinction between ASML’s wafer-fabrication systems and Besi’s assembly-equipment portfolio. ASML CEO Christophe Fouquet identified the shipment in the company’s 2025 annual-report message. ASML 2025 Annual Report: CEO message
The supplier network behind the equipment
Equipment makers themselves rely on specialized suppliers. ASML says approximately 80% of its bill of materials is sourced from its global supplier network and identifies ZEISS as its optical partner for EUV mirrors. The 80% figure describes ASML alone; it should not be treated as a statistic for the semiconductor-equipment sector as a whole. ASML 2025 Annual Report
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This layered supply chain helps explain why chip production depends on more than the company whose name appears on a tool. A finished system can bring together complex components and expertise from multiple specialist businesses, while the equipment maker integrates the tool and supplies associated software and services.
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