CXMT (ChangXin Memory Technologies) is a Chinese DRAM manufacturer founded in 2016. It commercially launched 8Gb DDR4 after tape-out, testing and production milestones between 2018 and 2019. Counterpoint’s Q2 2026 revenue table puts CXMT at 10% of global DRAM revenue, behind Samsung at 38% and SK hynix at 25%. That is a significant conventional-DRAM foothold, but it does not yet translate into a comparable position in HBM, the stacked memory used in AI accelerators. In Counterpoint’s Q2 2026 HBM table, SK hynix held 50% and Samsung 33%; CXMT was not listed as a material share.
What CXMT is
ChangXin Memory Technologies, usually abbreviated CXMT, is a Chinese company that designs, researches, manufactures and sells dynamic random-access memory (DRAM). Its stated markets include mobile phones, PCs, tablets, servers and other applications. The company was founded in 2016 and is therefore much younger than Samsung Electronics or SK hynix as a major global memory supplier.
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DRAM is the temporary, high-speed working memory used while a processor runs software. A phone, desktop, notebook, graphics system or server loads active data into DRAM because it is much faster to access than storage. DRAM loses its contents when power is removed, unlike flash storage, and is sold in several product families for different bandwidth, power and packaging requirements.
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CXMT is a real commercial producer rather than only a research project. Its company history records an 8Gb DDR4 tape-out in July 2018, successful testing in May 2019, a mass-production announcement in September 2019 and first-order product sales in November 2019. Those milestones establish commercial DDR4 activity; they do not, by themselves, establish parity with the largest suppliers in process technology, yields, customer qualification or advanced products such as HBM.
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Why DRAM comparisons need two separate measures
“How big is CXMT?” has no single answer unless the product category and measurement period are specified. Conventional DRAM includes mainstream memory such as DDR4, DDR5 and low-power mobile DRAM. HBM is also DRAM, but it uses vertically stacked dies, a wide interface and advanced packaging for very high bandwidth. AI accelerators are the most visible HBM customers.
Market-share figures in this article are revenue shares, not wafer capacity, shipped bits or installed memory. Revenue share changes with prices, product mix and demand, and it can move sharply from one quarter to another. HBM share is reported separately because its economics and qualification requirements differ from those of commodity DDR modules.
CXMT’s documented development timeline
- 2016 — Company founded: CXMT began as a Chinese DRAM-focused manufacturer.
- July 2018 — 8Gb DDR4 tape-out: The company recorded completion of a design tape-out for an 8Gb DDR4 device.
- May 2019 — Testing completed successfully: CXMT reported successful testing of that DDR4 work.
- September 2019 — Mass production announced: The company announced mass production of its DDR4 memory.
- November 2019 — First-order sales: CXMT’s history records sales of products from its first orders.
This sequence matters because it separates an announced design from a product that reached manufacturing and customers. CXMT’s corporate material also says it has launched multiple DRAM products and aims to become a leading technology-driven manufacturer. It does not publish independent yield, speed or market-share comparisons that would prove equivalence to Samsung or SK hynix.
Global DRAM position in Q2 2026
Counterpoint Research’s Q2 2026 global DRAM revenue table reports the following distribution:
| Company | Q2 2026 global DRAM revenue share | What the figure means |
|---|---|---|
| Samsung | 38% | Largest share in this quarter’s table |
| SK hynix | 25% | Second-largest share in this quarter’s table |
| Micron | 24% | Third-largest share in this quarter’s table |
| CXMT | 10% | Fourth-largest share; up from 4% in Q2 2025 in the same comparison |
| Nanya | 2% | Reported share |
| Others | 1% | Combined remainder in the table |
On this measure, CXMT is a substantial supplier but remains well behind each of the three largest companies. Its reported increase from 4% in Q2 2025 to 10% in Q2 2026 indicates rapid growth in revenue share over that interval. It does not mean CXMT produced one-tenth of the world’s DRAM bits or has one-tenth of global manufacturing capacity.
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Why another 2026 snapshot says CXMT had 8%
A separate Counterpoint snapshot published on July 31, 2026 reports Samsung at 38%, SK hynix at 29%, Micron at 22% and CXMT at 8%. The values do not match the Q2 table exactly, even though both are from 2026. Different publication dates, datasets, product definitions or estimation methods can produce different percentages.
| Counterpoint publication | Samsung | SK hynix | Micron | CXMT |
|---|---|---|---|---|
| Q2 2026 global DRAM revenue table | 38% | 25% | 24% | 10% |
| Snapshot published July 31, 2026 | 38% | 29% | 22% | 8% |
The practical rule is simple: always print the quarter or publication date and the source when quoting a market share. “CXMT has 10% of DRAM” is incomplete without that qualification.
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What products does CXMT make?
CXMT’s company description covers DRAM for phones, PCs, tablets, servers and other systems. Its documented commercial milestone is 8Gb DDR4. Public material supplied for this comparison does not establish a complete, independently verified product list by generation, speed grade or customer.
| Memory category | What is established | What is not established by the cited material |
|---|---|---|
| DDR4 | 8Gb tape-out in July 2018; testing in May 2019; mass-production announcement in September 2019; first-order sales in November 2019 | Current share by speed grade, yields and customer-by-customer volumes |
| DDR5 | CXMT states it has launched multiple DRAM products | A specific DDR5 launch date, validated speed range or independent volume estimate |
| LPDDR/mobile DRAM | Mobile phones are among CXMT’s stated application markets | A complete LPDDR generation and qualification list |
| Server DRAM | Servers are among the stated application markets | Named server customers, platform qualification breadth or reliability statistics |
| HBM | Counterpoint described production as a target for the end of 2026 | Proven volume production, customer qualification, yield or material market share |
Therefore, the safe answer to “Does CXMT make DDR4 or DDR5?” is that DDR4 commercialization is specifically documented, while the supplied evidence does not verify a complete current DDR5 portfolio. CXMT may discuss multiple DRAM products, but a claim about a particular DDR5 or LPDDR part should be checked against a dated product brief or customer qualification notice.
CXMT versus Samsung and SK hynix: the main competitive axes
| Axis | CXMT | Samsung | SK hynix |
|---|---|---|---|
| Company history in this evidence | Founded 2016; documented DDR4 commercialization milestones in 2018–2019 | Global leader in Q2 2026 DRAM revenue; Samsung’s own HBM4 announcement dated February 12, 2026 | Second in Q2 2026 conventional DRAM revenue and first in Q2 2026 HBM revenue |
| Q2 2026 conventional DRAM revenue share | 10% | 38% | 25% |
| HBM revenue share, Q2 2026 | Not listed as a material share | 33% | 50% |
| Advanced process or packaging claim in the supplied sources | Corporate material does not publish independent yield, speed or share comparisons | HBM4 mass production using sixth-generation 10-nanometer-class 1c DRAM and a 4nm logic base die | Specific process and packaging figures are not stated in the supplied material |
| HBM timing | Target described as production from the end of 2026 | HBM4 mass production announced February 12, 2026 | Largest reported HBM revenue share in Q2 2026 |
The table shows why “catching Samsung and SK hynix” depends on the product. CXMT has made visible progress in conventional DRAM revenue, while the Korean companies have a proven commercial and customer-facing position in HBM. Conventional DRAM share cannot be converted directly into HBM capability.
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What Samsung has disclosed about HBM4
Samsung’s February 12, 2026 announcement says its HBM4 entered mass production using a sixth-generation 10-nanometer-class 1c DRAM process and a 4nm logic base die. Samsung reports a standard speed of 11.7Gbps, up to 13Gbps, and bandwidth of up to 3.3TB/s per stack.
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Where CXMT stands on HBM
Counterpoint research director MS Hwang said, “CXMT is targeting to produce HBM from the end of 2026. The new Shanghai fab is geared to produce AI chips, including HBM.” This is a target, not evidence of volume output, accepted yields or customer qualification.
Counterpoint’s Q2 2026 HBM revenue table lists SK hynix at 50%, Samsung at 33% and Micron at 18%. CXMT is not listed as a material share in that table. The gap is therefore not merely a difference in branding: HBM requires stacked-die manufacturing, advanced packaging, electrical validation and qualification with demanding accelerator platforms.
A credible CXMT HBM challenge would require public evidence across several steps: working samples, repeatable volume production, acceptable yields, a named or independently confirmed customer, and sustained revenue. The available statements establish an end-of-2026 target, but not those outcomes.
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Scale, supply reliability and customer qualification
Revenue share is a useful indicator of commercial scale, but buyers also need to know whether a supplier can deliver consistent volumes and pass platform qualification. The supplied sources do not provide CXMT’s independent yield data, defect rates, on-time delivery record, qualification list or long-term failure statistics. They also do not provide directly comparable figures for Samsung and SK hynix on those measures.
For a memory module or system purchase, qualification usually means more than the DRAM die functioning in a laboratory. The module design, firmware, electrical margins, thermal behavior, refresh characteristics and a system vendor’s validation process all matter. A company can have a functioning chip without being interchangeable with a qualified part from another supplier.
For that reason, a manufacturer’s market-share gain should be read as evidence of increasing commercial presence, not as a guarantee that every CXMT part is a drop-in replacement for a Samsung or SK hynix device.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.Geopolitical and export-control exposure
Memory manufacturing depends on specialized fabrication equipment, materials, packaging and a global supplier network. Export rules and licensing decisions can affect a company’s access to some inputs or tools, while policy changes can also alter customer sourcing decisions. These are strategic risks for every memory producer operating across borders.
The available evidence does not establish a specific restriction, exemption or production impact for CXMT. Treat export-control commentary as a factor to monitor rather than as proof that a particular product is unavailable or technically inferior. A procurement decision should rely on the supplier’s current qualification, continuity plan and legally compliant supply documentation.
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How to evaluate a CXMT-based memory product
- Identify the exact memory type: Confirm whether the module or device uses DDR4, DDR5, LPDDR or another category. Do not infer the die maker from the memory standard.
- Check the part number and datasheet: Look for the actual DRAM component, speed grade, voltage, density, timings and operating-temperature rating.
- Verify platform support: Consult the motherboard, notebook or server vendor’s memory compatibility list and firmware notes.
- Ask who is qualified: For business or server deployment, request the supplier’s qualification statement, change-notification policy and replacement process.
- Assess continuity: Confirm lead time, minimum order quantities, warranty terms and whether an equivalent second source is approved.
- Test the assembled product: Run the system vendor’s memory diagnostics and stress tests at the intended speed rather than assuming that a module’s label guarantees compatibility.
Retail listings often identify only the module brand and capacity, not the DRAM die manufacturer. A listing for a “DDR4 RAM memory module” should therefore not be presented as proof that it contains CXMT silicon unless the seller provides a verifiable component-level part number.
What CXMT’s growth means for the DRAM market
CXMT’s move from a 2018 tape-out to reported 2019 mass production and a 10% Q2 2026 global DRAM revenue share shows that a newer supplier can become commercially meaningful in a concentrated market. More suppliers can increase sourcing options and put pressure on pricing, especially in mainstream memory.
At the same time, the market remains segmented. HBM has different packaging, qualification and demand dynamics from ordinary desktop or mobile DRAM. Samsung and SK hynix’s Q2 2026 HBM shares demonstrate that leadership in conventional DRAM does not automatically confer leadership in AI memory.
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One free scan finds every outdated or missing driver and matches the right update for your exact hardware.Free scan · exact hardware matchThe next milestones to watch for CXMT are independently verifiable HBM volume production, customer qualification, sustained yields and repeated revenue disclosure. Until those are documented, CXMT is best described as a fast-growing conventional-DRAM producer with an HBM ambition, not as a peer of Samsung and SK hynix across every memory category.
Bottom line
CXMT is a genuine Chinese DRAM manufacturer, founded in 2016 and commercially established through documented 8Gb DDR4 milestones. Counterpoint’s Q2 2026 table gives it 10% of global DRAM revenue, compared with Samsung’s 38% and SK hynix’s 25%. That is meaningful growth, but the comparison changes in HBM: SK hynix held 50% and Samsung 33% of Q2 2026 HBM revenue, while CXMT was not listed as a material supplier. Samsung has announced HBM4 mass production, whereas CXMT’s HBM production is described as a target beginning at the end of 2026.
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