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Snapdragon 8s Gen 3 vs Dimensity 8450: Specifications and Benchmark Comparison (2026)

The Dimensity 8450 leads in AnTuTu 11, Geekbench 6 multi-core and 3DMark graphics, while the Snapdragon 8s Gen 3 leads in Geekbench 6 single-core and offers Wi-Fi 7. Here are the specs and benchmark averages, with their limits.
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Neither chip wins across the board. In the compiled NanoReview results available in 2026, the Dimensity 8450 leads in AnTuTu 11, Geekbench 6 multi-core, and both 3DMark graphics tests shown, while the Snapdragon 8s Gen 3 leads in Geekbench 6 single-core. Qualcomm’s platform also specifies Wi-Fi 7, which MediaTek’s Dimensity 8450 page does not list (it specifies Wi-Fi 6E). Treat every score below as an aggregate of many phones, not a controlled test of the two chips in identical hardware.

Specifications side by side

The table below uses each vendor’s own platform description where one is available. Where a value appears only in one source, the other chip’s cell says so rather than guessing. The Qualcomm figures come from its Snapdragon 8s Gen 3 Mobile Platform Product Brief (copyright 2024), and the Dimensity figures come from MediaTek’s official Dimensity 8450 specification page.

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Feature Snapdragon 8s Gen 3 Dimensity 8450
Model or part number SM8635 Not stated on MediaTek’s page
Process node 4 nm Not stated in the cited sources
CPU layout 1× Cortex-X4 at 3.0 GHz, 4× Cortex-A720 at 2.8 GHz, 3× Cortex-A520 at 2.0 GHz (clock speeds as listed by NanoReview) 8× Cortex-A725 in three groups: 1× with 1 MB L2, 3× with 512 KB L2 each, 4× with 256 KB L2 each
Cache Not stated in the cited sources 6 MB L3 and 5 MB system-level cache
GPU Adreno 735 Arm Mali-G720 MC7
Memory LPDDR5X up to 4200 MHz, up to 24 GB LPDDR5X (maximum speed and capacity not stated on the cited page)
Storage UFS 4.0 UFS 4 with MCQ
AI processing Qualcomm AI Engine with Hexagon NPU MediaTek NPU 880
Modem Snapdragon X70, peak rates of up to 6.5 Gbps downlink and 3.5 Gbps uplink Modem performance up to 5.17 Gbps (modem model not named)
Wi-Fi and Bluetooth Wi-Fi 7 via FastConnect 7800; Bluetooth not stated in the cited brief Wi-Fi 6E; Bluetooth 5.4
Video Not stated in the cited sources 4K60 capture and playback
Camera sensor support Not stated in the cited sources Up to 320 MP
Maximum display support Not stated in the cited sources WQHD+ up to 144 Hz

What the platform differences mean in practice

CPU design

The two chips take different routes to their core layouts. The Snapdragon 8s Gen 3 uses one high-performance Cortex-X4 core for peak single-threaded work, backed by four Cortex-A720 cores and three efficiency-oriented Cortex-A520 cores. The Dimensity 8450 uses eight Cortex-A725 cores with no separate efficiency tier in the cited description, so its scheduling depends on how the phone maker and kernel group the cores. That design difference helps explain why the two chips can finish a single-threaded task and a multi-threaded workload in different orders, as the benchmark section below shows.

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Graphics and AI

Graphics differ in architecture: Adreno 735 on the Qualcomm side and Mali-G720 MC7 on the MediaTek side. The graphics benchmark results below are the most direct evidence of how those designs compare, though they are still aggregates. On AI, MediaTek’s page describes the NPU 880 as supporting “the latest global mainstream LLMs, SLMs, and LMMs.” That is MediaTek’s own claim about its ecosystem, not an independent test of model performance or app behavior.

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Memory and storage

Both chips use LPDDR5X and UFS 4-class storage, so the gap here is in what each vendor states. Qualcomm gives a memory speed (4200 MHz) and capacity ceiling (24 GB). MediaTek’s page names the memory type but not those limits. Real-world memory and storage performance also depends on how the phone maker configures them.

Connectivity

Qualcomm lists Wi-Fi 7 and a faster modem ceiling than MediaTek’s stated figure. MediaTek lists Wi-Fi 6E and Bluetooth 5.4. Those are platform capabilities. A phone only gets them if its maker includes the matching radio parts and enables them for the market where it is sold, so check the handset’s own specification sheet before assuming Wi-Fi 7 or the highest modem rate.

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Benchmark results

NanoReview’s comparison page reports averaged scores from phones using each chip. These are not results from one phone run by the publisher. The numbers below are reproduced as published, and the sample counts are shown because they differ sharply between the two chips.

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Test (version as labelled by NanoReview) Snapdragon 8s Gen 3 Dimensity 8450 Higher score
AnTuTu 11 total 1,797,821 2,016,572 Dimensity 8450
AnTuTu 11 CPU 556,525 656,057 Dimensity 8450
AnTuTu 11 GPU 503,679 641,242 Dimensity 8450
AnTuTu 11 memory 307,418 256,365 Snapdragon 8s Gen 3
AnTuTu 11 UX 430,199 462,908 Dimensity 8450
AnTuTu 11 sample count 287 results 25 results Not applicable
Geekbench 6 CPU single-core 1,923 1,612 Snapdragon 8s Gen 3
Geekbench 6 CPU multi-core 5,179 6,210 Dimensity 8450
Geekbench 6 CPU sample count 64 results 7 results Not applicable
3DMark Steel Nomad Light 1,033 (8 FPS graphics test; 90% stability shown) 1,467 (11 FPS graphics test; stability not provided) Dimensity 8450
3DMark Solar Bay 4,992 (19 FPS graphics test) 6,549 (25 FPS graphics test) Dimensity 8450
3DMark Wild Life Extreme 3,116 No score shown Not established
PCMark 3.0 15,526 (14 phone models in the aggregation) 17,957 (2 phone models in the aggregation) Dimensity 8450

On the averages as published, the Dimensity 8450 is about 12% ahead on AnTuTu 11 total and about 20% ahead on Geekbench 6 multi-core. The Snapdragon 8s Gen 3 is about 19% ahead on Geekbench 6 single-core. The Steel Nomad Light gap is about 42% and the Solar Bay gap about 31%. These percentages are simple arithmetic on the published averages. They are not measured everyday speed differences.

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How to read these numbers

Sample counts are lopsided

The Snapdragon averages draw on 287 AnTuTu 11 results and 64 Geekbench 6 CPU results. The Dimensity averages draw on 25 and 7. A seven-sample average can swing with a few unusual devices, so the Dimensity Geekbench 6 figures in particular should be treated as indicative. The published aggregation also does not fully explain its inclusion rules or control for phone model and firmware version.

Benchmark versions and conditions

Scores move with benchmark version, operating system build, cooling design, and whether a phone was tested cold or after sustained load. None of those are normalized in the comparison. Compare these figures only with each other, not against scores from a different benchmark version or a different site.

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Where the vendor claims come from

MediaTek’s own performance claims on its Dimensity 8450 page are comparisons against a previous-generation Dimensity platform, according to the page’s footnote. They show progress within MediaTek’s line. They do not show how the chip compares with the Snapdragon 8s Gen 3.

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Which chip fits which use

  • Short, lightly threaded tasks: The Snapdragon 8s Gen 3 has the higher Geekbench 6 single-core average, which may matter for app launches and other bursty work. The gap is one benchmark’s average, not a guaranteed speed advantage in daily use.
  • Multi-threaded and gaming-style workloads: The Dimensity 8450 has the higher AnTuTu 11 totals, GPU and CPU subscores, Geekbench 6 multi-core average, and both shown 3DMark graphics results. That is the more consistent pattern in the published data, though the Steel Nomad and Solar Bay results come from NanoReview’s aggregation and not from a single test session.
  • Wi-Fi and modem capability: Choose the Snapdragon platform if Wi-Fi 7 or the higher stated modem ceiling matters to you, and confirm the handset actually includes it.
  • Memory-heavy tasks: The Snapdragon 8s Gen 3 leads on the AnTuTu 11 memory subscore, and its published memory ceiling (up to 24 GB) is stated explicitly.

The chip is only part of the phone

Two phones with the same chip can differ widely in sustained performance, battery life, display quality, camera hardware, software update length, and the radio bands enabled in your region. Those factors often matter more than a few percent of benchmark score. Before comparing specific handsets, check each model’s cooling design, update policy, and certified bands for your country.

NanoReview’s Dimensity 8450 device list includes the Oppo Reno 14 Pro and Oppo K13 Turbo, among other models. Its listing does not establish which phones are sold in your market today or at what price. For Snapdragon 8s Gen 3 phones, verify the exact model and availability on the maker’s or retailer’s own site, since the sources reviewed here do not provide a current handset list.

Sources

Benchmark figures are NanoReview 2026 aggregates, cited as NanoReview, 2026. The AnTuTu 11, Geekbench 6, and 3DMark results are compiled averages from that comparison page, not measurements made for this article.

Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon at the time of purchase will apply.

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