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Thermal design for a lidless space-grade FPGA is an assembly-level problem, not a matter of choosing a heatsink by chip name. Start with the exact part and package, then design and analyze the heat path and mechanical load path for that package, board, mounting arrangement, and spacecraft environment. The right approach differs: AMD Versal XQR guidance describes contact with the exposed die, while Microchip’s guidance for the RTG4 and RT PolarFire configurations covered in AN5558 centers on a cold plate behind the PCB.
Start with the exact package and design case
“Lidless” does not identify a universal package geometry or mounting method. Before selecting an interface material or cold plate, record the details that determine how heat can leave the device and what mechanical loads the assembly can tolerate.
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- Device: exact ordering code, package configuration, and package drawing for the selected FPGA.
- Heat generation: estimated power by configuration and workload, including the operating modes relevant to the mission.
- Board and mounting: PCB material, dimensions, stack-up, copper distribution, attachment points, and any support frame or brackets.
- Thermal neighbors: nearby components and other heat sources that affect the board or local environment.
- Mission conditions: worst-case hot and cold boundaries and the applicable conduction and radiation paths in the actual spacecraft installation.
Use the package’s thermal and mechanical limits alongside the board design. A device temperature grade alone cannot show what junction temperature a particular power profile will produce or whether the complete assembly has adequate margin.
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The two vendor examples below are different implementations, not competing universal rules. Apply the guidance only to the package configurations and mounting methods it covers.
#1 Best Overall
- Compatible with Raspberry Pi 4 Model B --- This Armor Lite Aluminum Heatsink is only designed for Raspberry Pi 4 Model B 1GB/2GB/4GB/8GB Version.
- Support PWM Speed Control --- Different from ordinary fans, this cooling fan supports PWM speed regulation, which is perfectly compatible with Raspberry Pi OS.
- Good Heat Dissipation Effect --- With 3510 ultra-quiet cooling fan and thermal pads, it can lower the temperature of Pi Board quickly.
- Lightweight and Easy to Install --- With screwdriver and 2pcs screws, it's easy to fix the heatsinks with Pi Board.
- Package Includes: 1 x Armor lite heatsink with pwm fan for Raspberry Pi 4B, 1 x Screw driver, 2 x Screws, 4 x Thermal Pads, 1 x User Manual;
| Design question | AMD Versal XQR lidless guidance | Microchip RTG4 and RT PolarFire guidance |
|---|---|---|
| Primary heat-transfer interface | A heatsink island contacts the exposed die. The stiffener and die may be at different heights, so a flat sink resting on the stiffener may not contact the die. AMD AM013, revision 1.10, released 2026-07-31. | For the package configurations described in AN5558, the recommended primary path is a cold plate against the rear of the system PCB, beneath the devices. Microchip AN5558, January 2025. |
| Mechanical support | Set attachment pressure to preserve contact without risking device damage; follow the selected package’s mechanical limits. AMD AM013 and DS946. | For CCGA mounting, AN5558 recommends metal frames and L-shaped corner brackets. If a top heatsink is used, support it through the frame and PCB rather than loading the FPGA package. |
| Model approach | Use an accurate device model and model the assembled system under worst-case environmental conditions. AMD WP563 describes simplified detailed models for early iterations and full detailed models for sign-off. | Model the board and its cold-plate heat path for the actual assembly and mission boundaries; AN5558 describes conduction and radiation as the heat-transfer modes in vacuum. |
For AMD Versal XQR: make die contact deliberate
AMD’s AM013 packaging manual says the lidless Versal packages target large devices and can operate up to 10°C cooler at the same power dissipation. This is AMD’s stated package benefit, not a guaranteed system-level temperature reduction for every heatsink, board, or spacecraft installation.
The contact geometry matters. The package stiffener can be higher or lower than the die, so the heatsink needs an island positioned to reach the die. This is a package-specific instruction; it is not a general rule to press a heatsink onto every exposed FPGA die.
Rank #2
- [Brand Overview] Thermalright is a Taiwan brand with more than 20 years of development. It has a certain popularity in the domestic and foreign markets and has a pivotal influence in the player market. We have been focusing on the research and development of computer accessories. R & D product lines include: CPU air-cooled radiator, case fan, thermal silicone pad, thermal silicone grease, CPU fan controller, anti falling off mounting bracket, support mounting bracket and other commodities
- [Product specification]AX120R SE; CPU Cooler dimensions: 125(L)x71(W)x148(H)mm (4.92x2.8x 5.83 inch); Product weight:0.645kg(1.42lb); heat sink material: aluminum, CPU cooler is equipped with metal fasteners of Intel & AMD platform to achieve better installation
- 【PWM Fans】TL-C12C; Standard size PWM fan:120x120x25mm (4.72x4.72x0.98 inches); fan speed (RPM):1550rpm±10%; power port: 4pin; Voltage:12V; Air flow:66.17CFM(MAX); Noise Level≤25.6dB(A), the fan pairs efficient cool with low-noise-level, providing you an environment with both efficient cool and true quietness
- 【AGHP technique】4×6mm heat pipes apply AGHP technique, Solve the Inverse gravity effect caused by vertical / horizontal orientation. Up to 20000 hours of industrial service life, S-FDB bearings ensure long service life of air-cooler radiators. UL class a safety insulation low-grade, industrial strength PBT + PC material to create high-quality products for you. The height is 148mm, Suitable for medium-sized computer case
- 【Compatibility】The CPU cooler Socket supports: Intel:1150/1151/1155/1156/1200/1700/17XX/1851,AMD:AM4 /AM5; For different CPU socket platforms, corresponding mounting plate or fastener parts are provided
For the Microchip configurations in AN5558: cool through the PCB
Microchip’s January 2025 application note addresses RTG4 and RT PolarFire space implementations in which the cold plate is placed on the PCB’s rear, directly beneath the devices. For CCGA assemblies, it describes frames and L-shaped corner brackets as structural supports. If a top sink is also used, its load should go into the frame and PCB rather than the FPGA package. AN5558 warns that direct top loading can increase stress during shock and vibration and cause damage.
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Select the die-to-heatsink interface by contact and compatibility
For AMD’s die-to-heatsink contact, an interface material fills microscopic gaps caused by surface roughness; surfaces that appear polished still do not make perfect contact across their full area. AMD’s DS955 lists phase-change material, thermal grease, and thermal pads as options. The suitable choice depends on die and heatsink flatness, allowable package pressure, and the interface’s total contact properties.
Rank #3
- Compatible with Raspberry Pi 5 --- This Armor Lite V5 Aluminum Heatsink is only designed for Raspberry Pi 5 4GB/8GB.
- Support PWM Speed Control --- Different from ordinary fans, this cooling fan supports PWM speed regulation, which is perfectly compatible with Raspberry Pi OS.
- Good Heat Dissipation Effect --- With 3510 ultra-quiet cooling fan and thermal pads, it can lower the temperature of Raspberry Pi Board quickly.
- Lightweight and Easy to Install --- With screwdriver and 2pcs screws, it's easy to fix the heatsinks with Raspberry Pi Board.
- Package Includes: 1 x Armor lite V5 for Raspberry Pi 5, 1 x Screw driver, 2 x Screws, 4 x Thermal Pads, 1 x User Manual;
Do not select a material from thermal conductivity alone. Check its supplier data and compatibility with the actual surface finish, package pressure limits, and long-term mission environment. A generic commercial TIM is not evidence that it is qualified for a flight assembly. The interface also has to work with the intended mounting pressure: too little pressure can leave poor contact; too much can damage the device.
Model the complete assembly in its mission environment
AMD’s system-level guidance calls for detailed thermal simulation of lidless packages under worst-case environmental conditions using models that accurately represent device performance across boundary conditions. Build the model around the real thermal path, rather than substituting a single junction-to-ambient figure for system analysis.
Rank #4
- Used for Raspberry Pi 4,Pi 3, Pi 2, Pi Model B+ & Retroflag NESPI CASE PLUS
- The DC 5V cooling fan run smoothly and quietly and it's good for heat dissipation of Pi board. It can be assembled easily by screws.
- The aluminum heatsinks has thermal conductive adhesive tape on the back.
- Package Includes: 1x Cooling Fan, 1x Screw Set, 3x Heatsinks for raspberry pi 3B+/3B/2B/B+,4x Heatsinks for raspberry pi 4 Model B
- NOTE: Pi board Not Included
- Represent the relevant structure. For a Versal die-top path, include the die, stiffener, heatsink island, interface layer, PCB, and spacecraft conduction and radiation paths. For a rear cold-plate path, represent the board stack-up, plate contact, mounting structure, and the paths that carry heat away from the plate.
- Use a model with suitable fidelity. AMD WP563, version 1.0, dated 2025-03-10, describes simplified detailed Versal models for early design iterations and full detailed models for sign-off. The full model includes package features such as substrate traces, interposer, silicon die, and stiffener ring; the simplified model omits detail to reduce simulation burden. AMD provides model access through its registered-customer download site.
- Apply the real boundary conditions. Evaluate mission hot and cold cases and the power modes that drive the design. In vacuum, do not assume air convection; Microchip AN5558 describes heat flow as restricted to conduction and radiation under vacuum conditions.
- Run uncertainty cases. Vary interface/contact assumptions, attachment pressure, surface flatness, manufacturing and material tolerances, and relevant thermal transport performance or tolerances, such as those of a heat pipe if the design uses one. Include uncertainty in environmental assumptions where applicable.
The AMD Versal XQR product page lists M-temperature support from -55°C to +125°C. That is a temperature-grade statement, not a predicted junction temperature for a particular operating mode, a blanket allowable junction range for every application, or evidence that a board-level solution has margin. Use the limits applicable to the exact device and design, then establish junction temperature and margin with the system analysis.
Validate the assembled design before sign-off
A model is only as useful as its inputs and the assembly it represents. Compare predictions with appropriate component- or board-level measurements and with the project’s environmental qualification evidence. Make sure the validation setup reflects the intended contact geometry, interface, attachment, and relevant thermal boundaries; a result from a different mounting arrangement does not establish performance for this assembly.
Best Value
- 40mm Heatsink Fan
- 4010 USB Fan + Heatsink + Pre-applied thermal conductive adhesive tape
- Dimesion: 40mmx40mmx25mm / 1.6" x 1.6" x 1.1" inch (LxWxH)
- Weight: 50 gram / 1.8 oz
Review both thermal performance and mechanical integrity. Confirm the intended heat-transfer path is actually engaged, that the chosen attachment maintains contact without exceeding package limits, and that the support structure carries loads as designed. Record the assumptions, uncertainty cases, measurements, and qualification evidence used to justify the final margin. Neither vendor guidance cited here supplies test results for a reader’s particular board or flight assembly.
What package figures can—and cannot—tell you
AMD’s Versal XQR product brief lists an AI Core package measuring 45 mm × 45 mm and an AI Edge package measuring 23 mm × 23 mm. Confirm the selected part’s current package drawing before using either dimension for layout or heatsink design; package footprint does not establish die height, contact geometry, or a thermal solution.
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