Cisco and NVIDIA announced a plan for an Ultra-Dense Small Form Factor Pluggable (USFP) optical module on October 12, 2026, at the Open Compute Project Global Summit. The proposed form factor is aimed at Ethernet networks inside large AI factories, with 400Gb/s-per-lane electrical signaling and up to 12.8Tb/s of aggregate capacity in its first 16-lane design.
This is an architecture and ecosystem announcement, not a product launch. Cisco and NVIDIA have not announced a shipping date, retail SKU, or a transceiver that can be ordered today.
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What Cisco and NVIDIA announced
USFP is a planned pluggable optical form factor that fits an OSFP-sized footprint while packing substantially more electrical lanes into that space. The first design uses 16 full-duplex lanes. Cisco describes the resulting configuration as supporting up to 12.8Tb/s of aggregate capacity, allowing operators to attach more 1.6Tb/s endpoints without adding another network tier.
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#1 Best Overall
- HIGH-SPEED CONNECTIVITY: 800GBase-SR8 OSFP transceiver delivers 800Gbps data transmission for high-performance network switch connectivity and data center applications
- MULTI-PLATFORM COMPATIBILITY: Works seamlessly with Cisco, Arista, Juniper, and other major networking equipment supporting OSFP112-800G-SR8-S standard
- TECHNICAL SPECIFICATIONS: 850nm wavelength with MPO multimode fiber interface, supports transmission distances up to 164 feet, features DDM digital diagnostics monitoring
- RELIABLE PERFORMANCE: Single-band frequency operation with 2-year warranty coverage for peace of mind and long-term network reliability
- PACKAGE CONTENTS: Includes 1 SFP28 transceiver module, compact dimensions of 7.1 x 1.6 x 7.9 inches for easy installation in compatible network switches
Why the form factor matters for AI factories
AI clusters increasingly connect large numbers of accelerators, switches and storage systems in tightly packed facilities. Every additional switching tier consumes rack space, adds latency and requires more power. Cisco and NVIDIA say USFP is intended to increase the amount of bandwidth available from the same front-panel area, so operators can scale compute without expanding the network footprint as quickly.
The companies also emphasize retaining the practical advantages of pluggable optics: technicians can replace a module without replacing an entire switch, and operators can choose optics for different reaches or fiber environments. That serviceability and deployment flexibility are central to the proposal rather than an attempt to replace pluggable networking with permanently installed optics.
Rank #2
- 800Gbps High-Bandwidth Connectivity Provides 800Gbps optical networking capability for next-generation Ethernet infrastructure, AI clusters, GPU computing, cloud data centers and high-performance computing applications.
- OSFP DR8 Gen2 Architecture Features an OSFP package with DR8 Gen2 optical architecture, providing 8-channel parallel optical connectivity for high-density 800G network deployments.
- Up to 500m Transmission Distance Designed for up to 500m transmission over single-mode fiber, making it suitable for longer-reach data center connections between racks, rows and network switching infrastructure.
- 1310nm Single-Mode Fiber Uses a 1310nm optical wavelength and single-mode fiber (SMF) architecture for high-speed parallel optical transmission over longer distances. Typical DR8 implementations use MPO-based parallel fiber connectivity.
- Silicon Photonics for AI & Data Center Applications Based on Silicon Photonics (SiPh) technology, the Gen2 design is positioned for high-density optical interconnects in AI computing, GPU clusters, HPC systems, cloud data centers and 800G Ethernet networks.
USFP specifications and claims
| Attribute | USFP proposal | Qualification |
|---|---|---|
| Electrical signaling | 400Gb/s per lane | Target stated in the October 2026 announcement |
| Initial lane count | 16 full-duplex lanes | First planned transceiver design |
| Aggregate capacity | Up to 12.8Tb/s | Bidirectional aggregate figure; not a shipping-product specification |
| Mechanical footprint | OSFP-sized | USFP is a proposed denser design, not simply an existing OSFP module |
| Roadmap | 32 lanes or more | Future direction; timing and final capacities are not stated |
| Compared with 200Gb/s-per-lane pluggable optics | 4× bandwidth density; approximately 1.3× power efficiency | Claims from Cisco and NVIDIA, not independent benchmark results |
“Bandwidth density” refers to capacity delivered in a given front-panel area, while power efficiency compares the amount of networking capacity delivered for power consumed. The announcement does not publish test conditions, module temperatures, reach, fiber type or a third-party benchmark for either claim.
How USFP compares with today’s pluggable approach
USFP is designed to preserve the operational model of pluggable optics while raising the lane rate and lane count. Existing 200Gb/s-per-lane solutions provide the comparison baseline used in the announcement, but the published material does not specify a particular incumbent module, connector pinout or interoperability profile.
Rank #3
- 800Gbps High-Speed Transmission Supports 800Gbps Ethernet connectivity with an 8-channel parallel optical architecture, designed for high-bandwidth AI clusters, cloud computing and next-generation data center networks.
- OSFP VR8 Form Factor Features the OSFP package and VR8 optical configuration, providing a high-density 800G optical solution for compatible Ethernet switches, routers and data center networking equipment.
- 30m / 50m Short-Reach Performance Designed for short-distance multimode fiber links, supporting up to 30m over OM3 and 50m over OM4/OM5, making it suitable for rack-to-rack and in-row data center connections.
- 850nm Multimode Optical Interface Uses an 850nm optical wavelength with multimode fiber (MMF) for high-speed short-reach optical transmission. The MPO interface supports high-density parallel fiber connectivity.
- Designed for AI & Data Center Networks Ideal for AI computing clusters, GPU networks, HPC systems, cloud data centers and 800G Ethernet infrastructure, providing high-bandwidth optical connectivity for demanding computing environments.
| Comparison axis | USFP plan | Existing 200Gb/s-per-lane baseline |
|---|---|---|
| Per-lane electrical rate | 400Gb/s target | 200Gb/s per lane |
| Initial lane count and capacity | 16 full-duplex lanes; up to 12.8Tb/s aggregate | Not stated for a specific product |
| Front-panel density | Claimed 4× bandwidth density | Reference point for the claim |
| Power efficiency | Claimed approximately 1.3× improvement | Reference point for the claim |
| Serviceability | Pluggable, field-replaceable model intended | Pluggable model |
| Deployment flexibility | Intended to retain pluggable flexibility | Pluggable flexibility |
| Network-tier impact | Designed to connect more 1.6Tb/s endpoints without adding tiers | Depends on the deployed architecture |
| Open, multi-source availability | Specification planned through a community-led project | Varies by existing standard and supplier |
| Product maturity | Design and ecosystem plan | Existing products vary; no specific product is identified here |
Who is involved in the ecosystem
Cisco and NVIDIA plan to create an open industry specification through an upcoming, community-led multi-source project. TE Connectivity and Amphenol are named collaborators for cages, connectors and modules, with more partners expected. A multi-source specification could reduce dependence on one supplier, but it does not guarantee that every future USFP module will work in every switch; electrical, thermal, firmware and management interoperability will still need validation.
The effort builds on work to interoperate NVIDIA Spectrum-X Ethernet networking with Cisco Silicon One-based Ethernet networks. The stated audience includes enterprises, neoclouds and sovereign clouds constructing AI infrastructure.
Can you buy a Cisco-NVIDIA USFP transceiver now?
No. The October 12, 2026 announcement describes planned hardware and a future specification. It gives no shipping date, orderable part number, retail listing or production qualification. Organizations planning deployments should treat USFP as a roadmap item and request formal availability, thermal, reach, connector, management and interoperability documentation before including it in a committed bill of materials.
What to watch next
- Publication of the community-led USFP specification and its licensing terms.
- Confirmed electrical and optical lane mappings, connector details, thermal limits and management interfaces.
- Interoperability testing across Cisco Silicon One, NVIDIA Spectrum-X and equipment from additional suppliers.
- Engineering samples, production-qualified modules, pricing and an announced ship date.
- Independent measurements of the claimed four-times bandwidth density and approximately 1.3-times power efficiency.
The Bottom Line
USFP is a future, OSFP-sized pluggable design targeting 400Gb/s electrical lanes and up to 12.8Tb/s bidirectional aggregate capacity in a 16-lane configuration. Its promised density and efficiency gains could reduce the need for extra AI-network tiers, but the specification and hardware are not yet available to buy.
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