Recommended Free Tools
ABF is a specialized insulating film used to build fine wiring inside some advanced semiconductor package substrates—not the substrate itself, and not a material confirmed in every AI accelerator. Its importance is growing because high-performance packages are getting larger and more complex as well as more numerous. Ajinomoto has announced a new production site planned to begin operating in 2032, while a September 2026 trade report describes tight supply and larger substrate roadmaps. The public evidence supports a long-term capacity challenge, but it does not establish the size of a current industry-wide shortfall.
What is an ABF substrate?
“ABF substrate” is common shorthand for a package substrate built using Ajinomoto Build-up Film (ABF). ABF is the insulating film between layers of fine circuitry; it is not the whole substrate. The substrate connects the very small terminals on a semiconductor die to the larger connections used by the package and the printed circuit board.
As an Amazon Associate I earn from qualifying purchases.
In a build-up process, manufacturers form successive wiring layers over a substrate core, with insulating material separating those layers. Ajinomoto says ABF’s surface can be laser processed and directly copper plated, allowing fine circuits to be formed. The company says a major semiconductor maker first adopted ABF in 1999 and describes the film as a standard material for high-performance CPU substrates.
PC Slower Than It Used to Be?
A free scan shows the junk files, broken settings and background clutter dragging Windows down - then fixes them in one click.Free scan · Windows 10 & 11Outdated Drivers Are Slowing You Down
One free scan finds every outdated or missing driver and matches the right update for your exact hardware.Free scan · exact hardware matchThat evidence supports ABF’s importance in high-performance computing and advanced packaging, not a claim that all AI accelerators use it. Ajinomoto’s 2025 ASV Report calls ABF essential for high-performance semiconductors and describes its global market position as an “overwhelming share.” That is the company’s characterization; the report does not provide a quantified market-share figure in the cited material.
#1 Best Overall
- ULTRA POWER - SUPPORTS THE LATEST RYZEN 9000 PROCESSORS IN HIGH PERFORMANCE - The MAG B850 TOMAHAWK MAX WIFI employs a 14 Duet Rail Power System (80A, SPS) VRM for the AMD B850 chipset (AM5, Ryzen 9000 / 8000 / 7000) with Core Boost architecture
- FROZR GUARD - Premium cooling features such as 7W/mK MOSFET thermal pads, extra choke thermal pads and an Extended Heatsink; Includes chipset heatsink, EZ M.2 Shield Frozr II, and a Combo-fan (for pump & system) header (3A)
- DDR5 MEMORY, PCIe 5.0 x16 SLOT - 4 x DDR5 DIMM SMT slots enable extreme memory overclocking speeds (1DPC 1R, 8400+ MT/s); 1 x PCIe 5.0 x16 SMT slot (128GB/s) with Steel Armor II supports cutting-edge graphics cards
- QUADRUPLE M.2 CONNECTORS - Storage options include 2 x M.2 Gen5 x4 128Gbps slots, 1 x M.2 Gen4 x4 64Gbps slot and 1 x M.2 Gen4 x2 32Gbps slot; Features EZ M.2 Shield Frozr II to prevent thermal throttling and EZ M.2 Clip II for EZ DIY experience
- CONNECTIVITY - Network hardware includes a full-speed Wi-Fi 7 module with Bluetooth 5.4 & 5Gbps LAN; Rear ports include USB 20G Type-C and 7.1 USB High Performance Audio with Audio Boost 5 (supports S/PDIF output)
Why does AI increase demand for ABF?
AI demand affects ABF through both chip volume and package design. Ajinomoto identifies high-performance computing, AI applications, multi-chip packages and 3D-IC packages as growth areas. It also says larger, more complex IC packages require more ABF per IC. Consequently, even if accelerator shipments were the only change, package growth could still increase the amount of film needed per device.
More ABF demand does not automatically translate into an equal number of finished substrates. The film is one input in a longer manufacturing chain. Substrate makers also need suitable materials such as glass cloth, equipment and factory capacity, then must achieve acceptable yields and produce output qualified for particular customers. A constraint at any of those stages can limit usable supply.
Rank #2
- AMD Socket AM4: Ready to support AMD Ryzen 5000 / Ryzen 4000 / Ryzen 3000 Series processors
- Enhanced Power Solution: Digital twin 10 plus3 phases VRM solution with premium chokes and capacitors for steady power delivery.
- Advanced Thermal Armor: Enlarged VRM heatsinks layered with 5 W/mk thermal pads for better heat dissipation. Pre-Installed I/O Armor for quicker PC DIY assembly.
- Boost Your Memory Performance: Compatible with DDR4 memory and supports 4 x DIMMs with AMD EXPO Memory Module Support.
- Comprehensive Connectivity: WIFI 6, PCIe 4.0, 2x M.2 Slots, 1GbE LAN, USB 3.2 Gen 2, USB 3.2 Gen 1 Type-C
Why are ABF substrates in short supply?
A September 10, 2026 Tom’s Hardware feature reports that ABF film capacity was fully loaded in the second quarter of 2026 and describes bottlenecks involving ABF, glass cloth and other materials, substrate equipment, large-format factories, yield and customer-qualified output. These are secondary-source reports; the available Ajinomoto announcements confirm plans to expand capacity and anticipated demand, but do not confirm utilization or quantify a current shortfall.
The distinction between nominal capacity and supply a customer can use matters. A factory’s theoretical output does not show how much material meets specifications, how quickly production can ramp, or how much finished substrate has cleared a customer’s qualification process. The cited reporting identifies these as parts of the constraint, but it does not provide a complete, comparable capacity-and-yield dataset across suppliers.
Rank #3
- AMD Socket AM4: Ready to support AMD Ryzen 5000/4000/3000 Series Processors
- Enhanced Power Solution: Digital 3+3 VRM Design and premium chokes and capacitors for steady power delivery.
- Advanced Thermal Armor: Chipset heatsinks for better heat dissipation.
- Boost Your Memory: Compatible with DDR4 and supports 4 DIMMS with Extreme Memory Profile support.
- Comprehensive Connectivity: 1x Ultra Durable PCIe 4.0 x16 slot, 1x PCIe 4.0 M.2 slot, 1x PCIe 3.0 M.2 slot, 4x USB 3.2 Gen 1 ports for hassle-free setup.
The same Tom’s Hardware feature reports projections for substrate-area growth and estimates of a supply-demand gap. Because their originating sources and methods were not independently established in the available material, those projections should not be treated as confirmed industry totals.
How does the substrate roadmap change package requirements?
Tom’s Hardware reports the following Ibiden roadmap for substrate dimensions and build-up structures. The figures are the roadmap as reported by that publication, not independently corroborated here against an original Ibiden presentation.
Rank #4
- AMD Socket AM5: Supports AMD Ryzen 9000 / Ryzen 8000 / Ryzen 7000 Series Processors
- DDR5 Compatible: 4*DIMMs
- Power Design: 14+2+2
- Thermals: VRM and M.2 Thermal Guard
- Connectivity: PCIe 5.0, 3x M.2 Slots, USB-C, Sensor Panel Link
| Target year | Substrate size reported | Build-up structure reported |
|---|---|---|
| 2026 | 90 × 90 mm | 10-X-10 |
| 2028 | 110 × 110 mm | 12-X-12 |
| From 2030 | 130 × 130 mm or larger | 14-X-14 |
Larger footprints and more complex structures illustrate why demand cannot be assessed by chip count alone: a more demanding package can require more substrate area and additional build-up layers. The reported roadmap does not state how many substrates Ibiden will produce at each size, what yields it will achieve, or how much qualified output will reach customers.
What is the Ajinomoto ABF factory roadmap?
Ajinomoto Co., Inc. announced on May 7, 2026 that it had acquired a site in Kani City, Gifu Prefecture, for a third ABF production base. Its plan is to start construction in 2028 and begin operation in 2032. The company framed the site as a way to expand production capacity and business continuity in anticipation of demand after 2030; it is separated from the existing Kawasaki and Gunma plants for continuity purposes.
Best Value
- Supports 12th/13th Gen Intel Core, Pentium Gold and Celeron processors for LGA 1700 socket
- Supports DDR4 Memory, Dual Channel DDR4 5333+MHz (OC)
- Enhanced Power Design: 12+1 Duet Rail Power System with P-PAK, 8-pin + 4-pin CPU power connectors, Core Boost, Memory Boost
- Premium Thermal Solution: Extended Heatsink, MOSFET thermal pads rated for 7W/mK, additional choke thermal pads and M.2 Shield Frozr are built for high performance system and non-stop gaming experience
- High Quality PCB: 6-layer PCB made by 2oz thickened copper and server grade level material
The announcement does not give the new site’s output capacity, production ramp, or a site-level target. Its 2032 operating date is therefore a planned milestone, not a published measure of how much additional film will be available or when customers will receive it. The announcement also does not quantify today’s supply gap.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.What do Ajinomoto’s shipment figures show?
Ajinomoto’s May 2024 investor presentation provides a company shipment-volume indicator, not a measure of total industry output. It sets FY2017 at an index of 100, shows FY2021 at 190, and marks FY2025 at a planned index of 345. The presentation describes growth from FY2020 through FY2025 as approximately 18% CAGR. Because FY2025 is explicitly a plan in that chart, 345 should not be presented as a realized 2025 result.
The figures indicate the scale of growth Ajinomoto was planning for its own ABF shipments. They do not specify the share of demand met, the contribution from individual factories, or the volume available to any particular substrate maker.
Do these 3 things before closing this tab:
1Fix the driver behind crashes, sound loss and screen glitches2Repair Windows errors before they cause bigger problems3Scan for outdated or missing drivers - takes under a minuteWhat the roadmap establishes—and what it does not
- Established by company material: ABF is an insulating film for fine circuitry in build-up substrates; Ajinomoto identifies AI and advanced multi-chip packaging among demand drivers; and the company has announced a third production site with operation planned for 2032.
- Reported by trade coverage: Q2 2026 full-load film capacity and the Ibiden size and layer-count roadmap. These claims remain attributed to the September 2026 Tom’s Hardware feature here.
- Not established by the cited figures: an industry-wide shortage quantity, the new factory’s eventual output, actual FY2025 shipment volume from the 2024 plan, or a complete comparison of suppliers’ capacity, yields and qualified deliveries.
For data-center planners, the practical implication is that substrate availability is a supply-chain risk worth tracking alongside accelerator demand. But the public figures cited here describe a planned company expansion and a reported supplier roadmap—not a quantified forecast of how many AI systems will be delayed.
Quick Recap
Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon at the time of purchase will apply.
