In PCB design, a via—short for vertical interconnect access (VIA)—is an electrical connection that carries a signal between conductive layers of a printed circuit board. It lets a circuit route between layers instead of keeping every connection on the same surface.
How a PCB via works
A printed circuit board can contain multiple conductive layers separated by insulating material. A via creates a conductive path through one or more layers of that stack, connecting parts of a circuit that are not on the same layer. The University of Barcelona repository’s PCB-via definition describes this inter-layer connection.
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In everyday PCB usage, designers usually say “via.” “Vertical interconnect access” is the expansion of the acronym VIA, rather than a separate component or a general name for every kind of vertical connection.
Via terms you may see in PCB fabrication
Fabrication discussions include terms such as filled via, via-in-pad, and mechanically drilled microvia. These labels describe different constructions or placements, but the cited examples do not establish a complete taxonomy or universal design rules. The Aerospace Industry Support Initiative’s 2015/16 impact report names these examples in a PCB manufacturing context.
#1 Best Overall
- Package Includes: The product contains 5 different sizes of circuit boards, 10Pcs 2x8 cm, 10Pcs 3x7 cm, 5Pcs 4x6 cm, 5Pcs 5x7 cm, 2Pcs 7x9cm, 32Pcs in total, it is the standard tenth-inch (0.1") spacing
- Easy to Use: 4 mounting holes at the corners of the PCB boards are convenient for installing them together
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- High Quality: Our PCB board made of durable glass fiber FR-4 material with 1.6 mm thickness
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VIA can mean something different outside PCB design
The acronym is context-dependent. In a 2021 semiconductor paper, Ramezani and co-authors use “vertical interconnect access” for superconducting contacts to a monolayer of molybdenum disulfide (MoS₂), not for a conventional PCB structure. The paper is titled “Superconducting contacts to a monolayer semiconductor.”
The phrase also appears in photonics research for an optical vertical interconnect. A SPIE technical summary indexed at CiteSeerX is evidence of that usage, though its metadata and full text are not confirmed here. When you encounter “VIA,” use the surrounding subject—PCB layout, semiconductor devices, or photonics—to determine its meaning.
Quick Recap
Best Value
- Useful in transferring breadboarded prototypes to reliable and permanent circuits
- Popular breadboard alignment for versatile prototyping purposes
- Adaptable with a variety of MCU boards. Compatible with Arduino Nano, ESP8266, NodeMCU, etc.
- Gold plated finish to prevent oxidation, and all holes are through-plated for mounting strength
- Lead free and RoHS compliant, longer shelf life
Rank #4
- High quality 9x15 cm, 1.6 mm thick double sided through-hole plated PCBs
- Standard 2.54 mm (0.1 inch) tie-point pitch
- Tie-points are 1 mm in diameter and laid out on a 34 x 54 grid (1890 total)
- Substrate is FR-4 fiberglass
- These ship in economy packaging. They are shrink wrapped and then protected by a cardboard shell
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- Selection of Multi-Sized Proto Boards - 31 pieces double-sided prototype boards of 5 different size to meet your demands when designing your own Arduino kits, electronic experiments and DIY projects. (10 pieces 2*8cm, 10 pieces 3*7cm, 5 pieces 4*6cm, 5 pieces 5*7cm and 1 pieces 7*9cm PCB boards)
- Header Connector - 10 pieces 40 pin male header, 10 pieces 40 pin pitch right angle male headers, 10 pieces 40 pin female header; pitch: 2.54mm, single row and straight connector
- Screw Terminal Block - 8 pieces 5.08-301-2P and 5 pieces 5.08-301-3P ; pitch: 5.08mm, rated voltage: 300V, rated current: 16A
- Jumper caps - 30 pieces standard 2.54mm pin spacing circuit board jumper cap in 6 colors, 5 pieces per color
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Rank #2
- 32 Boards In Five Sizes: Choose 4 × 6 cm, 3 × 7 cm, 5 × 7 cm, 2 × 8 cm or 7 × 9 cm boards for compact circuits, controller interfaces, classroom soldering exercises and larger point-to-point builds
- Double-Sided FR4 For Soldered Prototypes: Approximately 1.6 mm FR4 provides a rigid base for permanent electronics builds, while pre-tinned plated-through holes provide solderable connections accessible from both sides
- Standard 2.54 mm Grid Fits Common Through-Hole Parts: Lay out resistors, LEDs, DIP sockets, pin headers, terminal blocks, sensors and jumper wires on a 0.1 in pitch, then create each required connection with soldered leads, bridges or insulated wire
- From Breadboard Test To Permanent Build: Transfer a proven circuit into a compact soldered assembly for sensor nodes, controllers, alarms and STEM demonstrations; corner mounting holes help secure finished boards in enclosures or on panels
- Set Expectations Before Soldering: These are isolated-pad perfboards with no breadboard-style buses or stripboard traces, and the kit does not include components, wire, solder or tools; plan the layout and check continuity before applying power
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