Rapidus CORE—short for Rapidus Collaborative Open Rapid Ecosystem—is a framework announced by Rapidus on October 5, 2026, to connect semiconductor research, design, electronic design automation (EDA), intellectual property (IP), and manufacturing. Its first initiative is a group of 17 Design Solution Associates intended to help customers access design resources and expertise. CORE is an industry collaboration framework, not a chip, fabrication process, or consumer service; its EDA and IP components are planned expansions, not established programs.
What Rapidus CORE is—and what it is not
Rapidus describes CORE as a global ecosystem framework for developing and mass-producing advanced semiconductors. The idea is to coordinate capabilities across the semiconductor value chain so customers can begin development with access to design support and manufacturing connections. In its October 5, 2026 announcement, Rapidus said development requires integrating research institutions, EDA, IP, design, and manufacturing into an infrastructure customers can rely on. Rapidus CORE announcement
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The word “open” does not establish that CORE is open-source or that its services are free. The announcement describes an ecosystem, but does not publish a public sign-up process, service guarantees, customer eligibility rules, or commercial terms.
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Design Solution Associates
The first concrete part of CORE is its Design Solution Associates group, comprising 17 companies. Rapidus says the associates will contribute design resources and specialist knowledge, helping connect customers with Rapidus and supporting work from design through manufacturing for customers in Japan and overseas. The announcement does not specify each associate’s service menu or the terms on which customers can engage them, so membership alone should not be read as a guarantee that a particular service is available.
#1 Best Overall
- COMPATIBILITY: Development board supporting multiple wireless protocols including Bluetooth
- Thread, Matter, Zigbee, ANT, and NFC at 2.4GHz frequency
- PROCESSOR: Features the advanced nRF54L15 transceiver chip from Nordic Semiconductor for reliable wireless communications
- WIRELESS STANDARDS: Implements IEEE 802.15.4 protocol support for Matter, Thread, and Zigbee networking applications
- DEVELOPMENT PLATFORM: Comprehensive evaluation board designed for testing and prototyping wireless connectivity solutions
| Design Solution Associate | Design Solution Associate |
|---|---|
| AION Silicon Limited | Cadence Design Systems, Inc. |
| Dai Nippon Printing Co., Ltd. | GreatAsic Technology Sdn. Bhd. |
| HCL Technologies Limited | Infinecs Systems Sdn. Bhd. |
| Infosys Limited | MavissDesign Co., Ltd. |
| MosChip Technologies Limited | NSW Inc. |
| Oppstar Technology Sdn Bhd | Quest Global Services Pte. Ltd. |
| SkyeChip Berhad | Synopsys, Inc. |
| TOPPAN Inc. | Toshiba Information Systems (Japan) Corporation |
| Wipro Limited | — |
EDA and IP are future expansion areas
Rapidus says it intends to expand CORE beyond design into EDA, IP, and other categories. The October 2026 announcement does not name future EDA or IP participants or give a schedule for adding those categories. They should therefore be understood as planned areas of expansion, not a currently detailed CORE service offering.
How CORE could connect design with manufacturing
A company developing an advanced chip may need specialist design work as well as a path to fabrication. Rapidus’s stated model is to coordinate design resources from the associates with its own manufacturing capabilities, giving customers a route to engage across more of that process. The goal is to address the need for a broader value chain and specialist design capacity.
Rank #2
- DEVELOPMENT BOARD: Nordic Semiconductor NRF52-DK development and evaluation board designed for wireless applications and prototyping
- WIRELESS CAPABILITIES: Features Bluetooth
- (BLE) and ANT protocol support with 2.4GHz operation frequency for versatile connectivity options
- PROCESSOR OPTIONS: Compatible with both nRF52810 and nRF52832 transceivers, offering flexibility for different project requirements
- NFC SUPPORT: Includes Near Field Communication (NFC) capabilities, expanding potential use cases and application scenarios
That is the announced purpose, not evidence that CORE has already shortened development cycles, secured customer orders, improved yields, or delivered manufacturing results. The launch announcement provides no measured outcomes or comparative data that would establish those effects.
Where CORE fits in Rapidus’s manufacturing plans
CORE sits alongside Rapidus’s effort to develop leading-edge logic semiconductors and advanced packaging. Rapidus’s company timeline says its IIM-1 pilot line in Chitose, Hokkaido, began operating in April 2025; it reported electrical characteristics from 2nm gate-all-around (GAA) transistor prototypes in July 2025; and it lists 2027 as its target for starting mass production. These are company-reported milestones and a target—not confirmation that mass production has begun. Rapidus company overview and timeline
Rank #3
- EVALUATION BOARD: NRF9151-DK development board from Nordic Semiconductor designed for cellular IoT and GNSS applications
- CONNECTIVITY: Features both cellular connectivity and GNSS (Global Navigation Satellite System) capabilities for location-based applications
- DEVELOPMENT PLATFORM: Ideal for prototyping and testing IoT devices, supporting cellular network communications
- COMPATIBILITY: Designed to work with Nordic Semiconductor's development tools and software development kit
- APPLICATIONS: Perfect for creating IoT solutions, asset tracking systems, and location-aware connected devices
Government context and what it does not establish
On November 21, 2025, Rapidus announced that Japan’s government had selected it as the official business operator for measures intended to support stable production of high-speed information-processing semiconductors. The announcement described work including production facilities, prototyping, and demand development. It also said Rapidus planned to apply for 100 billion yen of investment through Japan’s Information-technology Promotion Agency; that was an intended application, not proof in that announcement of a completed investment. Rapidus announcement on government selection
The selection provides policy context for Rapidus’s manufacturing effort, but does not guarantee commercial success, customer demand, manufacturing yields, or readiness for mass production. CORE’s launch announcement is specifically about organizing an ecosystem and design support.
Quick Recap
Best Value
- DEVELOPMENT KIT: Nordic Semiconductor NRF5340-AUDIO-DK designed for audio application development with nRF5340 dual-core Bluetooth LE SOC
- VERSATILE CONNECTIVITY: Features multiple interface options including I2S, SPI, UART, and USB for comprehensive development capabilities
- POWER SPECIFICATIONS: Operates with flexible power supply range of 1.7V to 5V, suitable for various development scenarios
- TEMPERATURE RANGE: Capable of operating in environments up to +105°C, ensuring reliable performance across diverse conditions
- AI COMPATIBILITY: Supports Edge Impulse platform integration, enabling advanced machine learning and AI development capabilities
Rank #4
- Development Platform: nRF52833-DK evaluation board designed for prototyping and testing Bluetooth
- BLE, Thread, and Zigbee applications using the nRF52833 SoC
- Wireless Connectivity: Supports multiple protocols including Bluetooth
- (BLE), 802.15.4 (Thread, Zigbee) operating at 2.4GHz frequency for versatile wireless development
- Integrated Antenna: Features PCB trace antenna built directly on-board for immediate testing and development without requiring external antenna components
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