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An area-array package has its electrical terminals arranged in a grid on the underside of the package, within its outline. The layout uses the bottom surface for connections instead of placing them only around the edges. A ball grid array (BGA) is a common example, but “area array” is the broader term.
What an area-array package means
In an area-array package, terminations—the package’s electrical connection points—are distributed across a two-dimensional grid on the bottom. This differs from a perimeter-leaded package, whose connections run along its edges. IEC 60194-2:2025 uses the term for this arrangement; for formal standards work, consult the official IEC publication rather than relying on a catalog-hosted excerpt. IEC terminology reference.
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How area array differs from BGA
“Area array” describes where package terminals are arranged; “BGA” names one package type that uses that arrangement. A ball grid array has solder balls on one side of a substrate, set out in rows and columns. Some positions in the grid can be left without a ball, so the pattern need not be a completely filled rectangle. Column grid arrays are another example of area-array packaging.
Why use terminals across the underside?
A package with leads only around its perimeter is constrained by the package outline and the spacing between leads. An area array can use positions across the bottom surface, allowing more connections at a given pitch and potentially increasing I/O and package density. The actual capacity depends on package dimensions, pitch, terminal layout and the board design; the arrangement alone does not guarantee a particular number of connections.
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What to consider when comparing packages
Area array is a description of terminal placement, not a complete package specification. When comparing a particular package with a perimeter-leaded alternative, assess the whole connection and assembly problem:
- Terminal format: Identify whether the package uses balls, columns or another terminal form.
- Pitch and dimensions: Compare terminal spacing and package size with the available board area and manufacturing capabilities.
- I/O needs: Check that the number and arrangement of connections meet the design requirements.
- Board footprint and routing: Confirm that the board can accommodate the footprint and route signals to the required connections.
- Assembly and repair: Consider the assembly process and whether inspection, rework or replacement can be handled with the available equipment and procedures.
Area-array terminals can make repair more process-dependent than connections that are accessible at the package edge. The specific requirements vary by package and assembly process, so consult the package documentation and qualified assembly guidance for the device in question.
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In brief
An area-array package places its terminals in a grid on the underside. BGA is a familiar implementation with solder balls, while the broader area-array category is not limited to BGAs. The arrangement can support higher connection density, but suitability depends on the package, board layout and assembly requirements.
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- Clear Size Identification: Universal reballing stencil templates have specifications clearly marked on the surface for easy selection during your chip repair projects.
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