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TPM 2.0 and the TSS in Embedded Linux: Philip Tricca’s ELC 2017 Talk

Philip Tricca’s ELC 2017 talk treated TPM 2.0 as an embedded Linux integration effort spanning software packages, boot measurement, images, firmware, and boards.
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The ELC 2017 presentation “TCG TPM2 Software Stack & Embedded Linux” examined what it takes to bring TPM 2.0 into an embedded Linux system—not just how to use a TPM chip. Its examples span software packages, boot measurement, build images, and board integration. The tpm2-software community index lists Philip Tricca’s ELC 2017 talk under the related title “Securing Embedded Linux Systems with TPM 2.0.”

What was the ELC 2017 presentation about?

The talk approached TPM 2.0 from the perspective of embedded development. A TPM is only one part of the implementation: the operating system needs software to communicate with it, the boot chain must support the intended security behavior, and the target board and firmware must expose a usable TPM interface.

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The primary slide deck, titled “TCG TPM2 Software Stack & Embedded Linux,” identifies Philip Tricca and describes work involving TPM 1.2 and 2.0 packages, reference live images and initrds, Grub2 patches for measured launch, and platform integration. The community index uses “Securing Embedded Linux Systems with TPM 2.0” for Tricca’s ELC 2017 talk; these are title variants associated with the presentation, not proof that every similarly named 2017 session was the same talk.

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What did the talk say about the TPM software stack?

The TPM Software Stack (TSS) is the userspace software layer used by applications and system components to work with TPM functionality. In an embedded Linux project, the stack is part of a wider integration task: packages must be available for the target, the boot process must be able to perform relevant measurements, and the image and board configuration must support the design.

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The deck discusses TPM 1.2 and TPM 2.0 packages and reference images, while a secondary catalog describes broader topics in the talk: threat modeling, TPM protections, measured boot, TPM2 stack design, random-number generation, cryptographic operations, sealed storage, and local attestation. The catalog provides an outline rather than detailed implementation instructions for each topic.

One implementation caveat recorded in the slides was remaining TSS work for big-endian systems. That is a statement about the project’s status at the time of the 2017 presentation, not a description of present-day TSS support.

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  • 【Wide Compatibility – Gigabyte & ASUS】 Specifically designed for Gigabyte and ASUS desktop motherboards with a 20-1 pin (2x10 / GA 20-1) 2.54mm pitch LPC TPM header. Ideal for upgrading to TPM 2.0 on DDR4 systems. (Note: NOT compatible with 12-pin, 2x6, or 14-pin headers).
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How did the presentation connect TPM 2.0 to embedded platforms?

The presentation’s examples show why TPM support depends on a complete platform path, from hardware connection through firmware and boot software to Linux userspace.

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MinnowBoard Max

The slides mention work on a MinnowBoard Max board-support package (BSP) to add TPM 2.0 support as a machine feature. This is a historical development example; it does not establish current availability or compatibility for a particular board revision.

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ARM reference platform and Infineon SPI TPM

The deck also identifies an ARM reference platform using an Infineon TPM connected over SPI. The example makes the TPM’s bus interface an explicit integration consideration: a module’s interface must match what the target platform supports.

Boot measurement and coreboot

Grub2 patches for measured launch appear among the work described in the slides, and coreboot TPM 2.0 support is mentioned as a possible starting point. These are presentation-era project references, not confirmation that a current firmware, bootloader, or board combination is ready to use.

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What should developers verify before planning a similar setup?

The 2017 talk is useful as an architectural map, but it is not a current hardware compatibility guide. Check the complete target system rather than choosing a TPM module in isolation.

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  • TPM interface: Confirm the TPM’s bus and connection, such as SPI, are supported by the specific target board.
  • Board revision and documentation: Check vendor documentation for the exact board revision and its supported TPM configuration.
  • Firmware and boot chain: Verify that firmware and boot components support the required TPM behavior, including measurement if that is part of the design.
  • Kernel and userspace: Confirm that the target Linux kernel and TSS versions work together for the features the system needs.
  • Build footprint: Review the current tpm2-tss installation documentation, which describes building a reduced set of libraries for embedded targets. This is current upstream documentation, separate from what the 2017 presentation documented, and it does not certify a particular board-and-module pairing.
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What the presentation does—and does not—establish

The slides provide historical examples of TPM packages, measured-launch work, and integration on named platforms. They do not establish present-day project status, retail availability, or compatibility of current hardware. Likewise, the broader topic list comes from a secondary catalog and should not be mistaken for a detailed account of every implementation covered in the talk.

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For developers, the enduring lesson is that TPM 2.0 support is a system-integration problem: hardware interface, board support, firmware, boot software, Linux, and the TSS all need to align. The ELC 2017 presentation illustrates that work in its own period; current decisions require current documentation for the exact target.

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