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Samsung’s 2nm Roadmap: SF2, SF2Z and Backside Power Delivery

Samsung announced SF2Z with backside power delivery and a 2027 mass-production target. Here’s how it fits the SF2 roadmap and what performance claims are still unquantified.
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Samsung’s announced 2nm roadmap separates its SF2 process family by timing and features: the company scheduled SF2 production for mobile in 2025, with HPC and automotive applications to follow, and announced SF2Z with backside power delivery (BSPDN) for mass production in 2027. Those dates are Samsung’s roadmap targets as announced in 2023 and 2024—not confirmation that the milestones were later achieved. Samsung says SF2Z’s backside power design should improve performance, power and area (PPA) versus SF2, but it has not published numerical SF2Z results in the cited announcement.

Samsung’s announced SF2-family roadmap

The roadmap below reflects Samsung’s announcements at the time. The June 2023 release described SF2’s planned application schedule; the June 2024 release added SF2Z and gave its planned mass-production year.

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Process or application Samsung’s announced timing What the announcement says
SF2 for mobile Mass production planned for 2025, announced June 2023 Samsung’s initial stated application for SF2.
SF2 for high-performance computing (HPC) Application expansion planned for 2026, announced June 2023 Samsung said SF2 applications would expand to HPC.
SF2 for automotive Application expansion planned for 2027, announced June 2023 Samsung said SF2 applications would expand to automotive.
SF2Z Mass production planned for 2027, announced June 2024 A 2nm node variant incorporating optimized BSPDN, described as intended to improve PPA versus SF2.
SF1.4 2027 target, announced June 2024 Samsung said its performance and yield targets were on track at that time.

Samsung’s June 2023 comparison of SF2 with SF3 reported 12% higher performance, 25% greater power efficiency and 5% lower area. Those are Samsung’s figures for SF2 versus SF3; they are not SF2Z measurements. Samsung’s June 27, 2023 announcement does not establish that these gains carry over unchanged to SF2Z.

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What backside power delivery is meant to change

In Samsung’s description, BSPDN puts power rails on the backside of the wafer rather than routing power alongside signals on the front side. The aim is to ease congestion between power and signal lines, giving chip designers more room to route signals and deliver power.

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Samsung said SF2Z’s BSPDN should improve PPA compared with SF2 and significantly reduce voltage drop, also called IR drop. Lower voltage drop can help a chip receive steadier power under demanding workloads, which matters for HPC designs. The June 2024 announcement gives no numerical SF2Z PPA or IR-drop measurements, so these are stated benefits and design goals, not quantified results.

SF2 and SF2Z: what can be compared

Comparison point SF2 SF2Z
Backside power delivery The 2023 announcement does not describe BSPDN as part of SF2. Samsung announced optimized BSPDN as a feature of SF2Z in June 2024.
Stated applications Mobile first, with planned expansion to HPC and automotive in 2026 and 2027, respectively, per the June 2023 roadmap. Samsung highlighted HPC design performance when describing BSPDN’s expected benefits; the cited announcement does not provide a complete application schedule.
Announced production timing Mobile mass production planned for 2025; HPC expansion planned for 2026; automotive expansion planned for 2027, all announced June 2023. Mass production planned for 2027, announced June 2024.
Performance evidence Samsung reported SF2-versus-SF3 gains of 12% performance, 25% power efficiency and 5% area reduction in June 2023. Samsung said SF2Z should improve PPA over SF2, but supplied no numerical SF2Z comparison or measured result in the June 2024 announcement.
IR-drop evidence No SF2 IR-drop figure is stated in the cited announcements. Samsung said BSPDN should significantly reduce IR drop; no measurement is stated in the June 2024 announcement.

These disclosures do not support a numerical, apples-to-apples SF2-versus-SF2Z comparison. A process name or node label alone also cannot establish which option is better for a particular chip; design needs and measured results matter.

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What Samsung’s announcements establish—and what they do not

Samsung’s June 13, 2024 Foundry Forum announcement establishes that the company announced SF2Z, described its BSPDN approach and set a 2027 mass-production target. The cited releases do not confirm whether SF2Z subsequently entered production, nor do they report its yields, customer designs or measured performance. The 2027 date should therefore be read as the target Samsung announced in June 2024, not as verified delivery.

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