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A land grid array (LGA) is a package design in which flat conductive pads, called lands, are laid out in a grid on the underside of a component. There are no solder balls and no pins sticking out of the package. Texas Instruments describes it as a laminate substrate-based package that uses metal pads for external electrical connection instead of solder balls (as in the ball grid array). Most people meet the term on CPUs and motherboards, but the same package style also appears in soldered chips.
What “lands” means
The lands are the package-side contacts. They are flat metal pads, not pins and not balls. How the pads connect to the rest of the system depends on how the package is mounted, and that is where most confusion starts.
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Two ways an LGA package is connected
Socketed: the CPU case
In the familiar desktop and server CPU arrangement, the lands are on the processor. The motherboard socket carries the spring contacts. Intel’s Gaming Motherboard Buying Guide puts it this way: “Land Grid Array (LGA) sockets, used in many modern chipsets, essentially work the opposite way: pins on the socket connect to conductive lands on the CPU.” The contrast is with older pin grid array (PGA) CPUs, where the pins are on the processor.
One practical result is that the delicate contacts are in the socket rather than on the chip. Handle the socket with care when installing a CPU.
#1 Best Overall
- Intel LGA 1700 Socket: Ready for Intel Core 14th & 13th Gen Processors, Intel Core 12th Gen, Pentium Gold and Celeron Processors
- Ultrafast Connectivity: PCIe 5.0, two M.2 slots, Realtek 2.5Gb Ethernet, Wi-Fi 6, rear USB 5Gbps Type-A, front USB 5Gbps support
- Comprehensive Cooling: VRM heatsink, PCH heatsink, hybrid fan headers and Fan Xpert 2+
- Aura Sync RGB Lighting: Onboard Addressable Gen 2 headers for RGB LED strips, easily synced with Aura Sync-capable hardware
Soldered: not every LGA is removable
LGA does not mean “removable”. NXP’s assembly guidelines for LGA packages say an LGA package can be used in a socket or connected to a board using solder paste. When you describe an LGA part, say which method applies instead of assuming a socket.
LGA versus BGA
| Aspect | LGA | BGA |
|---|---|---|
| Package connection | Flat metal pads (lands) in a grid (TI) | Solder balls |
| Mounting | Socketed, or soldered with solder paste (NXP) | Soldered to the board; Intel says BGA processor packages are soldered into a system and do not use a socket (Intel) |
The sources reviewed support this comparison and the socketed CPU contrast with PGA. They do not support broader claims about every PGA design, so none are made here.
Rank #2
- LGA 2011 Socket: The X79 Server motherboard support Intel LGA2011 socket CPU processors (e.g. Intel Xeon E5 1620/1660/2603/2620/2667/2690, E5 1603 V2/ 2620 V2/26340 V2/2670 V2/2695 V2, etc.)
- Dual-channel DDR3: The Intel LGA 2011 gaming motherboard supports DDR3 Desktop/ECC/RECC memory up to 256GB (4*64GB), and supports 1066/1333/1600Mhz
- Stable Power Supply: 8-phase power supply, all-solid-state capacitor design, fine workmanship, professional stability. And the DDR3 mainboard is equipped with 24+8 pin power interface (please use a brand power supply of at least 500w)
- Rich Interfaces: The Micro ATX placa madre features RJ45 gigabit network interfaces, and the maximum network transmission rate can reach 1000bps/s. And with M.2 slots (support NVME SSD/NGFF SSD), PCIe 3.0 X16, PCIe 2.0 x1, SATA 3.0, SATA 2.0, USB 3.0, USB 2.0
- Excellent performance: The DDR3 computer motherboard uses Intel X79 chipset and 8-layer PCB material. And with Heat dissipation armor protection for strong heat dissipation, to ensure stable bus communication
Reading the labels: FC-LGA and LGA1700
FC-LGA
Intel’s Package Type Guide for Intel Desktop Processors (last reviewed February 6, 2025) states: “FC-LGA is short for Flip Chip Land Grid Array x.” “Flip chip” means the die sits on the side of the substrate opposite the land contacts. The “x” marks a package revision. This describes the package, not which motherboard it fits.
LGA1700
The number is part of a specific socket name. Per the same Intel guide, LGA1700 refers to the 1,700 contacts that interface with the LGA1700 socket. It is a product-specific label, not a synonym for LGA in general. Intel’s Xeon support page even has an article titled “What’s the difference between the sockets LGA 1700 and FCLGA 1700 on Intel Xeon Processors?”, a sign that readers often mix up the socket name and the package name. Its supported sockets page is the place to check Xeon pairings.
Rank #3
- LGA 1151 socket: Perfectly compatible with Intel 6th/7th gen Core i3/i5/i7, Pentium, Celeron Series processors. (Eg Core i3-7100, Core i5-7400, Pentium G4560, Celeron G3900.) It may not be compatible with Core i7 processors; confirm your processor model compatibility before purchasing
- Dual Channel DDR4 Slot: H110 mainboard is equipped with 2 DDR4 Non ECC memory slots, the maximum frequency is 2400MHz, and the maximum memory capacity is 32GB (Each memory slot supports 16GB)
- NVME/NGFF M.2 Interface: The M.2 interface can be manually converted to NVME and NFFF mode, and the control part can be manually pulled out. The two slots use different channels, the NVME M.2 slot uses the PCIe channel, and the SATA M.2 slot uses the SATA channel
- Other Interface: PCIe 2.0 X16 Slot, SATA 3.0, USB 3.0, VGA and High Definition Multimedia Interface, which can support 1080P high-definition video output without a graphics card.
- The package Includes: 1*SATA cable, 1*I/O baffle, 1*motherboard. The motherboard does not include a battery. User manual is not included in the package, you can download the user manual file on the product details page. If you need to download the driver, it is recommended to download: Driver Talent, or use Win 10 system
Why “LGA” alone does not tell you what fits
Intel states that desktop processor sockets are not interchangeable and must be matched to the motherboard, and that the processor also needs BIOS support. Two boards can both be “LGA” and still accept entirely different CPUs. Before buying, check:
- The exact socket name on both the CPU and the motherboard, such as LGA1700.
- The CPU support list published by the motherboard maker.
- The minimum BIOS version needed for your specific processor.
If you are shopping, search for the exact pairing, for example an LGA1700 motherboard, and not just “LGA”.
Quick Recap
Rank #4
- Compatible Range: The CPU cooler Backplate is only suitable for INTEL socket, Intel LGA 775/1150/1151/1155/1156/1200/1366/1700.
- Adjustable: This Backplate is easy to operate and simple to use, can be flexibly adjusted the size according to the hole position of motherboard.
- Strong and Long-lasting, Made of high quality Plastic (non-conductive). this non-conductive backplate prevents short circuits on the back of your motherboard, ensuring safer installation for your PC components.
- Thread: M3, Package Includes: 1 x Adjustable motherboard Backplate.Mounting screws, standoffs, and other hardware are NOT included.
- Perfect Replacement for Lost or Broken Backplate If you have lost or damaged your original cooler backplate, this kit provides a low-cost solution.Please confirm your motherboard socket and cooler requires a backplate before purchasing.
Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon at the time of purchase will apply.
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