Recommended Free Tools
CoolIT direct liquid cooling (DLC) is an integrated cooling chain, not just a coldplate: plates capture heat at server components, coolant loops carry it through each server, rack manifolds distribute coolant, and coolant distribution units (CDUs) connect the IT-side loop to air or facility-water heat rejection. The system’s efficiency and suitability depend on matching the server, rack, and facility designs; CoolIT’s published capability figures are vendor claims, not proof of universal energy savings.
What CoolIT direct liquid cooling is
CoolIT supplies liquid-cooling components and engineered systems for server platforms, including coldplates and server loops, alongside rack and facility-facing equipment. The aim is to remove heat close to high-power components rather than relying only on air moving through the server. CoolIT says its engineering work includes designing, validating, and mass-producing loops for server makers, and its OMNI coldplates and loops are supplied to OEMs. CoolIT’s server page says pre-built systems with its loops are available through leading OEMs and invites buyers to ask which systems use its coldplates.
As an Amazon Associate I earn from qualifying purchases.
Here, “seamless” is best understood as an integration proposition: the coldplate must suit the chip, the server loop must suit the platform, the rack distribution must supply the required flow, and the CDU must fit the facility’s method of rejecting heat. It does not mean that any CoolIT-equipped server can be connected to any rack or building without design work.
Free tools Windows power users keep installed
One-click scans. No signup required.
How coolant moves from a chip to the facility
- Coldplates capture component heat. A plate mounted against a processor or other heat-producing component transfers heat into circulating coolant. CoolIT describes processor coldplates for CPUs, GPUs, and ASICs, with peripheral plates available for components such as memory, storage, networking, and power hardware. See CoolIT’s coldplate technology overview.
- The server loop carries heat out of the system. Coolant flows through the coldplate loop inside the server. The loop and connections need to match the server platform and its service requirements.
- Rack manifolds distribute coolant. Technology Cooling System (TCS) piping and a rack manifold route coolant between the rack supply and individual servers. The rack design determines how servers connect and how coolant is distributed.
- The CDU manages circulation and heat transfer. A CDU pumps and thermally controls coolant, then transfers heat out of the IT-side liquid loop. Depending on the design, heat is rejected to ambient air or transferred to facility water.
- The facility rejects the heat. The CDU’s output must connect to a building-side heat-rejection system with suitable capacity and operating conditions. The precise facility connection depends on the selected architecture.
CoolIT’s portfolio overview describes CDUs, prefabricated TCS piping, rack manifolds, and OEM liquid-cooled servers as parts of this broader system.
#1 Best Overall
- Immersive Curved OLED Display: Experience stunning visuals on a 6.67” 2K curved OLED panel with vibrant colors and high contrast, delivering up to 500 nits brightness for exceptional clarity in any lighting.
- Motorized Control for Customization: Adjust the viewing angle effortlessly with the motorized pump head, featuring lift, rotation, and dual-axis movement, all managed through the intuitive L-Connect 3 software, allowing for a personalized setup.
- Innovative Hot-Swappable Design: Simplify installation with a magnetic hot-swappable display module that uses spring-pin connectors, enabling easy attachment and removal without powering down, perfect for reducing damage risks during assembly.
- Compact and Efficient Radiator: The 400 × 122 × 24 mm radiator fits approximately 90% of mainstream cases while maintaining optimal cooling performance, combined with durable server-grade tubing and adjustable routing options.
- Quiet Operation: Pre-installed with 3 UNI FAN TL FLEX fans, this water cooler systems combines high-performance airflow with advanced control options, featuring optimized LCP fan blades for efficient cooling, stability at speeds of up to 2600 RPM, and smart control through L-Wireless and motherboard integration. Dimensions: 120 x 124 x 28 mm; Speed Range: 0 - 2600 RPM; Noise: 33 dB-A.
CDU configurations and deployment choices
CoolIT describes both liquid-to-air and liquid-to-liquid CDUs, as well as rack- and row-based architectures, redundancy options, and system controls. Those are vendor-described product characteristics, not a determination of which configuration fits a particular site. A project must account for server requirements and the facility’s available heat-rejection infrastructure.
| Design choice | What it means | What to establish for a deployment |
|---|---|---|
| Liquid-to-air or liquid-to-liquid CDU | The method by which the CDU transfers heat away from the IT-side coolant loop. | Which heat-rejection interface the facility can support and what operating conditions the selected equipment requires. |
| Rack- or row-based CDU placement | Where cooling equipment sits relative to the servers it serves. | How the layout, piping, capacity, and service access fit the room and rack plan. |
| Redundancy and controls | Options CoolIT lists for its CDU portfolio. | The required availability design, control integration, and response to component or service interruptions. |
| Server and coldplate platform | The server OEM and components supported by the loop and plates. | Exact server model, processor configuration, connections, and service procedures; a shared component supplier does not guarantee interchangeability. |
For example, GIGABYTE says it offers CoolIT DLC as a standard option for H262-series high-density server systems and describes a rack manifold connecting liquid-cooled server nodes to rack-based CDUs. That is a specific OEM implementation, not evidence that all CoolIT-enabled servers use the same connections or rack design. GIGABYTE’s description of the implementation.
Rank #2
- Supports Intel LGA115x, LGA2011/2066 Square ILMquare ILM
- Supports AMD Socket AM4 and AM5
- Supports up to 253 Watts Heat
- Dissapation
- 5 x 18000 RPM PWM Cooling Fans Shin-Etsu 7762 Pre-Printed Thermal Compound
What the published performance figures do—and do not—show
CoolIT’s current server page claims “up to 30–40% better thermal performance.” The page, in the retrieved material, does not state the benchmark method or comparison conditions, so treat the range as a CoolIT claim rather than a transferable performance guarantee. The same page says the company supports OEM deployments in more than 80 countries; that describes the stated reach of its support, not a measure of system performance. CoolIT direct-liquid-cooled servers.
On its coldplate technology page, CoolIT describes a validated 15 kW single-phase coldplate. Its March 13, 2025 announcement describes a 4000W-ready single-phase direct-liquid-cooling coldplate. These are distinct vendor-reported capability statements; the retrieved material does not include the full validation report or establish that every server configuration can use either product. Coldplate technology · March 13, 2025 announcement.
Rank #3
- Immersive Curved OLED Display: Experience stunning visuals on a 6.67” 2K curved OLED panel with vibrant colors and high contrast, delivering up to 500 nits brightness for exceptional clarity in any lighting.
- Motorized Control for Customization: Adjust the viewing angle effortlessly with the motorized pump head, featuring lift, rotation, and dual-axis movement, all managed through the intuitive L-Connect 3 software, allowing for a personalized setup.
- Innovative Hot-Swappable Design: Simplify installation with a magnetic hot-swappable display module that uses spring-pin connectors, enabling easy attachment and removal without powering down, perfect for reducing damage risks during assembly.
- Compact and Efficient Radiator: The 400 × 122 × 24 mm radiator fits approximately 90% of mainstream cases while maintaining optimal cooling performance, combined with durable server-grade tubing and adjustable routing options.
- Versatile Fan Compatibility: Choose from multiple fan configurations, including Fanless, UNI FAN P28 V2, and UNI FAN TL FLEX versions, ensuring efficient cooling tailored to your system's needs for peak performance.
Thermal capacity at a processor is not the same thing as a reduction in total facility energy use. The sources cited here do not establish independently measured savings, total cost of ownership, or a generally applicable efficiency advantage for a particular site. CoolIT’s case-study index describes SWE01 in Stockholm as using DLC for greater rack density, reduced power use, and peak performance, and GWDG in Göttingen as using DLC to support higher-density computing, efficiency, and HPC research. The index does not provide before-and-after measurements, test boundaries, or independently audited savings. CoolIT case studies.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.Questions to answer before choosing a system
- Which exact server platforms are supported? Confirm the OEM model, processor and accelerator configuration, coldplate coverage, and server-loop connections.
- How will the rack receive and return coolant? Confirm the manifold, TCS piping, rack layout, and service access with the system provider and OEM.
- What facility interface does the CDU require? Establish whether the design is liquid-to-air or liquid-to-liquid, where the CDU will be placed, and what building-side heat rejection is available.
- What capacity and redundancy are required? Size the deployment against the workload and the planned availability design, rather than relying on a product headline alone.
- What supports any efficiency claim? Ask for the comparison baseline, measurement boundary, test conditions, and evidence relevant to the proposed configuration; distinguish chip-level thermal capability from site-level energy results.
- How will the system be operated and serviced? Clarify controls, monitoring, maintenance responsibilities, and how servers or cooling components are isolated and replaced.
These checks reflect the system-level nature of DLC: server, rack, and facility decisions have to work together. CoolIT’s descriptions establish its component and product architecture, while site-specific suitability and savings require evidence for the actual design.
Quick Recap
Rank #4
- Compatible Intel LGA115x, LGA1366, LGA1700, LGA2011/2066 Square ILM Mounting
- Compatible AMD AM2, AM3, FM1, FM2. AM4/AM5 Requires additional retention bracket DY-RT-AM4 (Not Included)
- Water Pump with Powerful Flow Rate 2.9 Liter Per Minute
- Pre-Printed Shin-Etsu Thermal Grease
- Four 80x38mm Cooling Fan with 4-Pin PWM Connector
Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon at the time of purchase will apply.
What’s actually slowing this PC down?
Pick the symptom - the matching free tool is one click away.
