AMD designs its chips but does not generally fabricate their silicon wafers itself. In its FY2025 Form 10-K, filed February 4, 2026, AMD names TSMC and GlobalFoundries (GF) for wafer fabrication in specified product categories, and lists separate companies that package and test products. AMD says nearly all final assembly and testing take place at third-party-operated facilities in China, Malaysia, and Taiwan. Its public filing does not identify the exact fab and packaging site for each retail CPU or GPU model.
Who makes AMD chips?
AMD is a fabless chip designer: it develops chip designs and product platforms, then relies on outside manufacturers for wafer fabrication and downstream production. AMD’s FY2025 Form 10-K names Taiwan Semiconductor Manufacturing Company (TSMC) for wafers for high-performance computing (HPC), FPGA, and adaptive SoC products. It also names GlobalFoundries for HPC wafer purchases at 12 nm and 14 nm.
The filing lists TSMC, United Microelectronics Corporation (UMC), and Samsung as suppliers of integrated circuits for programmable logic devices. These disclosures describe different product categories and supplier roles; they do not mean that each company makes every AMD chip.
How an AMD chip moves from design to finished product
- Design: AMD develops the chip design and product platform.
- Wafer fabrication: A foundry manufactures a silicon wafer containing many copies of a design. AMD’s latest annual filing associates TSMC with HPC, FPGA, and adaptive SoC wafers, and GF with HPC wafers at 12 nm and 14 nm.
- Wafer sort: The foundry may sort the wafer to identify functional dies before sending it onward.
- Assembly, packaging, and test: Wafers or dies go to assembly, test, mark, and packaging (ATMP) providers. Packaging turns a die into a usable semiconductor device; testing checks it before shipment. AMD names its Tongfu Microelectronics joint ventures, Siliconware Precision Industries (SPIL), and King Yuan Electronics Company (KYEC) as ATMP providers.
- Board-level production: For graphics products, AMD separately outsources board-level manufacturing to third parties. This is a later manufacturing step than making the GPU wafer or packaging the chip.
AMD describes the handoff this way in its FY2025 Form 10-K: “Wafers for our products are either sorted by the foundry or delivered by the foundry to our assembly, test, mark and packaging (ATMP) partners or subcontractors located in the Asia-Pacific region, who package and test our final semiconductor products.”
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Where are AMD chips assembled and tested?
AMD says nearly all product assembly and final testing take place at third-party-operated manufacturing facilities in China, Malaysia, and Taiwan. These are the countries AMD identifies for those downstream activities; the filing does not map each product to a particular country, facility, or supplier.
That distinction matters: a chip’s wafer may be fabricated in one place and packaged or tested elsewhere. “Made in” can refer to either stage—or to the finished graphics board—so a country-level answer should specify which step it means.
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What AMD’s filings do—and do not—say about specific models
The FY2025 filing gives supplier relationships and broad product categories, not a model-by-model manufacturing map. It does not establish which exact wafer fab or packaging site produced a particular Ryzen, EPYC, Radeon, or Instinct product. A supplier relationship alone is not enough to infer the origin of an individual retail chip.
Process-node statements also need a filing date. AMD’s FY2024 Form 10-K, filed February 5, 2025, said TSMC produced all microprocessor and GPU wafers at 7 nm or smaller nodes, while AMD relied primarily on GF for microprocessor and GPU wafers at nodes larger than 7 nm. The newer FY2025 filing describes relationships by product category and identifies GF purchases for HPC products at 12 nm and 14 nm. The earlier node-based wording should therefore be treated as a dated disclosure, not as a timeless allocation rule or a model lookup.
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AMD’s disclosed manufacturing partners at a glance
| Company or group | Role stated by AMD | Scope disclosed |
|---|---|---|
| TSMC | Wafer foundry | HPC, FPGA, and adaptive SoC products |
| GlobalFoundries (GF) | Wafer foundry | HPC wafer purchases at 12 nm and 14 nm |
| UMC and Samsung | Integrated-circuit suppliers | Programmable logic devices |
| Tongfu Microelectronics joint ventures, SPIL, and KYEC | ATMP providers | Assembly, packaging, and testing services |
These roles and scopes are those AMD describes in its FY2025 Form 10-K, filed February 4, 2026. The table is not a complete routing guide for individual products.
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Foundry relationships, product allocations, packaging routes, capacity, and facility geography can change. AMD’s newest annual or quarterly filing is the appropriate place to check for later disclosures. Even a current filing may still identify suppliers only at a broad category level, rather than naming the manufacturing route for a specific retail model.
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- For the state-of-the-art Socket AM5 platform, can support PCIe 5.0 on select motherboards
- Cooler not included
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- Processor provides dependable and fast execution of tasks with maximum efficiency.Graphics Frequency : 2200 MHZ.Number of CPU Cores : 8. Maximum Operating Temperature (Tjmax) : 89°C.
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