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A leadless chip carrier is an integrated-circuit package whose external connections are metallized terminations that are part of the package body—not separate leads projecting from or wrapping around it. The term describes how the package connects electrically; it does not, by itself, specify the material, dimensions, pin layout, or footprint.
What makes a chip carrier “leadless”?
The defining feature is the construction of its electrical terminations. IEC 60194-2:2025 defines a leadless chip carrier as a “chip carrier whose external connections consist of metallized terminations that are an integral part of the component body.” IEC 60194-2:2025 terminology entry
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That contrasts with a leaded package, where distinct leads extend from the package body. A leadless package’s contacts are part of the body itself. The definition does not prescribe one universal shape or layout: check the specific package drawing for dimensions, pitch, contact arrangement, and board-mounting details.
What does LCC mean?
LCC is ambiguous. Depending on the supplier and context, it can mean either “leadless chip carrier” or “leaded chip carrier.” Texas Instruments uses LCC for “Leaded Chip Carrier,” while Analog Devices documents both “Leadless Ceramic Chip Carrier” (also called “Leadless Chip Carrier”) and “Leaded Chip Carrier.” Spell out the term on first use, and use the manufacturer’s package name or code when identifying a part. Texas Instruments package terminology · Analog Devices package terminology
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- DIP IC Socket;Pitch:2.54mm/ 0.1Inches; Number of Pins:14
- Operating temperature: - 40 ℃ to+105 ℃; Contact resistance: 20mΩ Max
- Insulation resistance: 1000MΩ Min； Working voltage: AC500V
- You will receive: 10 pcs IC Socket 14P
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Common ceramic and plastic labels
- LCCC: Texas Instruments’ abbreviation for Leadless Ceramic Chip Carrier.
- LPCC: Texas Instruments’ abbreviation for Leadless Plastic Chip Carrier.
- CLCC: Microchip’s catalog label for Ceramic Leadless Chip Carrier.
These are examples of supplier terminology, not a guarantee that every manufacturer uses each abbreviation the same way. Confirm the package description in the relevant datasheet or catalog. Texas Instruments terminology · Microchip package drawing catalog
How are leadless chip carriers mounted?
Ceramic leadless chip carriers are surface-mount packages with bottom-terminated connections. In other words, their contacts are on the underside for connection to the board, rather than being separate projecting leads. That description is specific to the ceramic LCC examples cited by manufacturers; the name “leadless chip carrier” alone does not establish a universal mounting pattern or footprint. Infineon ceramic LCC information
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- ♛【What You Get】: This set include 122pcs dip ic sockets in 8 different size, which are they are sorted packed in a plastic box for easy storage and avoid mess.
- ♛【Package Detail】: 6pinx25pcs, 8pinx25pcs, 14pinx12pcs, 16pinx30pcs, 18pinx12pcs, 24pinx12pcs, 28pinx12pcs, 40pinx12pcs, total 122pcs.
- ♛【Product Material】: Our pin headers are made of insulated plastic and hard metal pin, strong and durable, the pins are not easy to break can be used for long times.
- ♛【Products Spacing】: 2.54mm/0.1 inches; Number of Pins: 6/8/14/16/ 18/24/28/40 ; Row Type: double row.
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Materials, applications, and package-specific details
Leadless chip carriers may be described by material, including ceramic and plastic variants. Infineon identifies power ICs, power MOSFETs, and oscillators among products in its ceramic LCC families. Kyocera lists LCC as one ceramic package configuration and notes that material and configuration depend on application and performance requirements. These are manufacturer examples, not a complete list of uses. Infineon ceramic LCC information · Kyocera ceramic packages
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One free scan finds every outdated or missing driver and matches the right update for your exact hardware.Free scan · exact hardware matchDo not infer that packages are interchangeable because both are called LCC. Before selecting or replacing a package, compare its terminal construction, material, outline, pitch, board footprint, and application requirements—including hermeticity where relevant. The exact values and limits must come from the package’s manufacturer drawing or applicable standard.
Rank #3
- DIP IC Socket;Pitch:2.54mm/ 0.1Inches; Number of Pins:20
- Operating temperature: - 40 ℃ to+105 ℃; Contact resistance: 20mΩ Max
- Insulation resistance: 1000MΩ Min； Working voltage: AC500V
- You will receive: 10 pcs IC Socket 20P
- We are a strong team. We have high-quality service. If you encounter any problems when purchasing products, please contact us in a timely manner, and we will give you the most satisfactory response.
For co-fired ceramic chip carrier construction, SEMI G50 covers fine-pitch top-brazed leaded and top-metallized leadless forms. Its stated scope concerns hermetic packaging, including high-speed digital VLSI examples, with interconnection to printed wiring assemblies and modules by solder attachment or “leads last” techniques. SEMI lists the specification as a paid standards download; consult the standard for its complete requirements. SEMI G50
Quick Recap
Best Value
- Product: Product Name: DIP IC Socket, Spacing: 2.54mm/ 0.1in, Row-to-Line Distance (Approx.): 7.6mm / 0.3in, Pins: 8
- Used: When installing, first solder the chip to the IC connector, and then solder the IC connector to the PCB board, when you need to install or replace the chip, directly remove the connection between the IC connector and the PCB board, without changing the chip and connector Connection
- Features: It is easy to disassemble the chip. With the IC socket, the chip can be directly inserted and unplugged without using an electric soldering iron for desoldering, which is easy to replace
- Application: This product is suitable for small experiments, research and development, and production requirements
- Package includes: You will get 50 X 8Pin IC chip socket Adaptor 2.54mm Pitch
Rank #4
- DIP IC Socket;Pitch:2.54mm/ 0.1Inches; Number of Pins:8
- Operating temperature: - 40 ℃ to+105 ℃; Contact resistance: 20mΩ Max
- Insulation resistance: 1000MΩ Min； Working voltage: AC500V
- You will receive: 20 pcs IC Socket 8P
- We are a strong team. We have high-quality service. If you encounter any problems when purchasing products, please contact us in a timely manner, and we will give you the most satisfactory response.
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