Samsung Electronics is reported to be planning two memory-chip testing facilities at Yen Binh Industrial Park in Thai Nguyen province, Vietnam. The reported plan sets a Q4 2027 target for the first line to begin operating, followed by a second line in 2028. These are planned milestones, not evidence that construction or production has begun.
What Samsung is planning in Thai Nguyen
The project company named in a Thai Nguyen provincial project document is Samsung Vietnam Semiconductor, registered at lots CN-11 and part of CN-12 in Yen Binh Industrial Park. The document records company registration on March 13, 2026, and investment registration on March 12, 2026. Thai Nguyen project document
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Seoul Economic Daily reported on October 5, 2026, citing Samsung documents filed with provincial authorities, that Samsung Electronics plans two fabs for memory-chip testing. The report describes a back-end operation: testing chips after wafer fabrication, rather than making silicon wafers in a fabrication plant. No Samsung Electronics public announcement confirming the two-fab details or total investment was identified in the cited reporting. Seoul Economic Daily report
Reported investment and schedule
The newspaper reports a planned total investment of VND 105.7944 trillion for the two Samsung Electronics facilities. It renders that amount as approximately KRW 5.48 trillion and US$3.9 billion; those conversions are the report’s figures. Investment figure and conversions
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| Milestone | Reported target |
|---|---|
| First facility, V1 line | Begin operations in Q4 2027 |
| First facility, V2 line | Begin operations in 2028 |
| Second facility | Construction planned to start in 2028 |
All dates are targets in the plan reported by Seoul Economic Daily from documents filed with Thai Nguyen authorities; they should not be read as confirmed opening dates or completed construction. Seoul Economic Daily report
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.How this differs from Samsung’s other Thai Nguyen semiconductor investment
A separate project can cause confusion: Samsung Electro-Mechanics is expanding a Vietnam plant that makes FCBGA semiconductor substrates. Substrates are components used in semiconductor packaging, not memory chips undergoing the testing described in Samsung Electronics’ reported plan. The company announced approximately KRW 2.51 trillion for equipment for the expansion and set a target of completion and operation by June 2030. Samsung Electro-Mechanics announcement Thai Nguyen industrial-zone authority confirmation
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| Project | Company and activity | Investment and timing |
|---|---|---|
| Reported two-fab plan | Samsung Electronics; memory-chip testing | VND 105.7944 trillion planned total, as reported by Seoul Economic Daily; V1 targeted for Q4 2027, V2 for 2028, and second-facility construction planned to start in 2028 |
| FCBGA plant expansion | Samsung Electro-Mechanics; semiconductor-substrate production | Approximately KRW 2.51 trillion announced by the company; target completion and operation by June 2030 |
Samsung Electro-Mechanics president Chang Duckhyun said: “As the AI and high-performance computing markets grow rapidly, high-value-added semiconductor substrates are becoming increasingly important as key components that determine semiconductor performance and supply chain stability.” Samsung Electro-Mechanics announcement and quotation
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