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On October 5, 2026, Japanese chipmaker Rapidus announced the Rapidus Collaborative Open Rapid Ecosystem, or CORE. It is a framework that links organizations across the semiconductor value chain to support development and mass production of cutting-edge chips. The first piece is Design Solution Associates, a group of 17 design companies. They are meant to connect customers with design resources and expertise, including early-stage design work for Rapidus’s 2nm foundry.
What CORE is, and what it is not
CORE is an ecosystem framework. It is not a chip, a process node or a standalone design tool. Rapidus says the aim is to assemble capabilities from the whole chain (research, EDA, IP, design and manufacturing) around what customers need to develop and produce advanced semiconductors.
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The company’s own rationale is in its release:
“Today, semiconductor development requires more than just manufacturing technology; it is essential to integrate the entire semiconductor value chain —including research institutions, EDA, IP, design and manufacturing — to provide customers with a development and production infrastructure they can rely on.”
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This is corporate prose from Rapidus, not a remark by a named executive. Rapidus also cites a shortage of advanced semiconductor talent as a reason to build a design ecosystem with design-related companies.
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Design Solution Associates: the first initiative
Rapidus says the member companies will contribute design resources and specialized expertise and act as a bridge between customers and Rapidus. The stated ambition is stronger support from design through manufacturing, for customers in Japan and overseas. The framing is that customers can start development earlier on Rapidus’s advanced 2nm foundry.
The announcement does not explain how customers are matched with partners, how partners were selected, or what contracts, fees, service levels or governance apply.
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The 17 companies
Rapidus listed the members alphabetically:
- AION Silicon Limited
- Cadence Design Systems, Inc.
- Dai Nippon Printing Co., Ltd.
- GreatAsic Technology Sdn. Bhd.
- HCL Technologies Limited
- Infinecs Systems Sdn. Bhd.
- Infosys Limited
- MavissDesign Co., Ltd.
- MosChip Technologies Limited
- NSW Inc.
- Oppstar Technology Sdn Bhd
- Quest Global Services Pte. Ltd.
- SkyeChip Berhad
- Synopsys, Inc.
- TOPPAN Inc.
- Toshiba Information Systems (Japan) Corporation
- Wipro Limited
The list mixes EDA vendors (Cadence, Synopsys), large IT and engineering services firms, printing and imaging companies, and design houses from Japan, India, Malaysia and Singapore. The announcement does not give each member’s individual scope, geographic coverage or deliverables, so it would be a mistake to assign a specific role to any one company.
What comes next, and what is not yet known
Rapidus says it will expand CORE beyond design into EDA, IP and other categories, and strengthen partnerships in those areas. These are plans. The announcement gives no launch dates, no named future partners by category, no service catalog, no eligibility rules and no commercial terms. It also does not show that any particular service is generally available.
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The only figure in the announcement is the 17-company count. It contains no performance or cost numbers, customer case studies, measured reductions in design time, wafer pricing, yields, foundry capacity or committed 2nm customer schedules. None of these should be read into the framework.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.Who should care
- Chip designers and startups considering 2nm: CORE signals a route to design help before committing, but terms are unpublished. Ask Rapidus directly about intake and scope.
- EDA and IP vendors: Two of the biggest EDA names are already in the first group, and Rapidus says EDA and IP categories are coming.
- Design-services firms: Membership positions a company as a named intermediary between customers and Rapidus.
If you are comparing partners, the useful questions are the partner’s specialization, its access to the EDA and IP stack, its experience with the target process and design stage, its support availability in your region, and its contract scope and pricing. The announcement supplies no comparative data on any of them.
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Source
This article is based on Rapidus Corporation’s announcement, “Rapidus Unveils ‘Rapidus CORE’, New Global Ecosystem Framework Supporting the Development and Mass Production of Cutting-Edge Semiconductors,” published October 5, 2026 and read on October 7, 2026. It reports the company’s stated intentions and partner list. It does not independently verify partner commitments, commercial readiness or future timing.
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