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Plan a co-packaged optics (CPO) switch by budgeting power and heat for the complete system, then matching a cooling architecture to component limits, package heat paths, reliability requirements, and facility capability. CPO shortens the electrical connection between the switch ASIC and optical engines; it does not eliminate heat or establish a universal cooling setpoint.
What changes when optics are co-packaged?
In a CPO switch, optical engines sit close to the switch ASIC in a shared package or package assembly. Shorter electrical paths can reduce the power used to drive high-speed signals between the ASIC and optics. But the ASIC and optical engines also occupy a concentrated thermal area, where heat from one component can affect another. The result is a system-design trade-off: potential link-power savings alongside more demanding package-level thermal planning.
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The Optical Internetworking Forum (OIF) puts the core requirement plainly: “Co-packaged engines will require some sort of thermal management, either a conduction path to remove heat or to isolate the engine from other heat-generating components.” Its 2020 OIF-Co-Packaging-FD-01.0 framework is useful for identifying design questions, but it is not a product specification or a current survey of vendor deployments.
There is no single power budget, safe temperature, or cooling target that applies to every CPO switch. Those values depend on the particular ASIC, optical engines, laser arrangement, package, operating modes, and system cooling design. Treat them as vendor- and project-specific inputs.
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Does CPO reduce switch power?
It can, but the answer depends on what is counted and what technology CPO is compared with. A comparison of optical transceivers alone is not equivalent to a comparison that also includes host SerDes, nor is either necessarily a comparison of total switch or facility power.
A 2026 analysis by Alan F. Evans in the Journal of Lightwave Technology reports CPO optical-transceiver energy-efficiency improvements of 23% relative to LPO transceivers and 67% relative to DSP transceivers. When host SerDes are included, the reported improvements are 44% and 69%, respectively. The same paper estimates switch-power reductions of 18% for CPO links relative to LPO links and 36% relative to DSP links. These are the paper’s comparisons and estimates, not guaranteed savings for a particular deployment. Evans cautions that reported savings vary and that the scope and technology generation included in a comparison matter. See the article, published May 28, 2026, in the Journal of Lightwave Technology.
| Reported comparison | Reported result | How to interpret it |
|---|---|---|
| CPO optical transceiver vs. LPO transceiver | 23% energy-efficiency improvement | Optical-transceiver comparison reported by Evans; does not by itself establish whole-switch savings. |
| CPO optical transceiver vs. DSP transceiver | 67% energy-efficiency improvement | Optical-transceiver comparison reported by Evans; use the paper’s definitions and scope. |
| CPO vs. LPO, including host SerDes | 44% energy-efficiency improvement | Includes host SerDes in the reported comparison; not directly interchangeable with the transceiver-only figure. |
| CPO vs. DSP, including host SerDes | 69% energy-efficiency improvement | Includes host SerDes in the reported comparison; does not include every possible system or facility overhead. |
| Estimated switch-power reduction for CPO links vs. LPO links | 18% | Evans’s estimate; confirm system boundary and technology generation before using it for planning. |
| Estimated switch-power reduction for CPO links vs. DSP links | 36% | Evans’s estimate; not a universal reduction for all switch designs. |
For an engineering comparison, define the boundary before using any percentage. At minimum, state whether it includes the ASIC, host SerDes, optical engines or transceivers, laser sources, fans or pumps, and power-conversion losses. Keep facility cooling overhead separate unless it is measured consistently for both alternatives. Comparing a switch-only CPO estimate with a facility-inclusive pluggable-optics figure can produce a misleading result.
Also distinguish energy efficiency from an absolute power reading. An efficiency percentage describes the comparison defined by its author; it is not a promise that a particular switch draws that percentage less power under every traffic pattern. Use the 2026 figures to frame questions for a vendor, then obtain like-for-like power data for the actual bandwidth, component generation, and configuration being evaluated. Avoid applying a transceiver-level percentage directly to a rack or facility budget.
How to build a power and heat budget
Start with the complete configuration, not a headline bandwidth or a transceiver rating. Record the number and type of ASICs and optical engines, the laser architecture, airflow direction, redundancy, traffic conditions, and the expected inlet-temperature range. Then separate the switch-package budget from rack and facility overhead so the comparison boundary remains visible.
Collect component and system figures
Request maximum and representative operating power for the ASIC, every optical engine, any separate laser sources, fans or pumps, and power-conversion stages. Ask which operating mode each number describes and whether it includes losses. Build at least two cases: representative operation and a worst case that combines the demanding traffic and ambient conditions the design must support.
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Nearly all electrical power consumed by the equipment ultimately becomes heat that the cooling system must reject. For a first-pass thermal budget, therefore, sum the power within the chosen boundary and treat it as the approximate heat load. Keep the boundary explicit: a switch-only heat estimate does not include rack or facility cooling energy, and a facility figure may include overheads absent from a component budget.
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Make the budget auditable. For each figure, record the component or system it describes, whether it is typical, maximum, or measured, the operating mode and ambient condition, and whether fans, pumps, power supplies, or conversion losses are already included. This helps prevent double-counting a load or leaving it out when component figures are reconciled with the vendor’s total-system value.
Use published examples only as context
OIF’s 2020 framework gives a representative 12.8 Tb/s, 1RU switch example. It lists 432 W of NPU power and 384 W for 32 400G QSFP56-DD ports at 12 W each. Its example total consumption is 900 W typical and 1,500 W worst case, with fans, power supplies, and typical optical dissipation included in the described system. These figures illustrate how system components add up; they are not a CPO switch specification and should not be substituted for vendor data.
| OIF representative 1RU example (2020) | Published value | Scope note |
|---|---|---|
| Switch bandwidth | 12.8 Tb/s | Describes the representative example, not a universal CPO configuration. |
| NPU power | 432 W | Component value in the example. |
| Optical-port power | 384 W | 32 400G QSFP56-DD ports at 12 W each. |
| Total consumption, typical | 900 W | Example total including fans, power supplies, and typical optical dissipation. |
| Total consumption, worst case | 1,500 W | Example worst-case total for the described system. |
Use this example to check that your accounting has not omitted major loads, not to assume that a CPO design will draw the same amount. For a real design, calculate the total from the actual component configuration and then reconcile the sum against the vendor’s system-level figures. Record whether figures are maximum, typical, or measured under a particular workload.
The OIF figures also illustrate why component sums and total-system numbers should not be treated as interchangeable. The NPU and optical-port entries describe selected loads, while the typical and worst-case totals cover a broader system boundary. The difference is not a universal allowance to apply to another switch: it reflects the example’s other loads and stated assumptions. Ask the supplier to explain any gap between component-level estimates and the system draw it specifies.
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OIF’s framework compares air cooling, closed-loop liquid, open-loop liquid, and immersion cooling. The choice is not just about maximum heat-removal capacity. Compare the permitted temperatures and gradients, reliability dependencies, facility infrastructure, serviceability, acoustics, deployment maturity, and total cost alongside the thermal requirement.
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| Architecture | Capacity and operating trade-offs | Infrastructure and reliability considerations | Design implications |
|---|---|---|---|
| Air cooling | Familiar and widely used, but with limited cooling efficiency; fan noise can constrain deployment. | Can work with hot-swappable fan arrays. Assess airflow delivery, fan redundancy, and acoustic limits. | Check that air reaches the package heat sources and that the specified operating envelope remains achievable at the highest expected inlet temperature. |
| Closed-loop liquid cooling | Offers greater cooling capacity than air in OIF’s comparison and can operate more quietly. | Pump reliability and cost are considerations. OIF described data-center deployment as limited when its 2020 framework was written; that statement is not a current market survey. | Confirm the liquid interface, pump and loop requirements, maintenance plan, and behavior when cooling capacity is reduced or lost. |
| Open-loop liquid cooling | OIF’s framework describes greater capacity than closed-loop liquid cooling. | Requires an external flowing-liquid supply and a heat exchanger. A supply failure may affect multiple units, while facility plumbing and heat rejection add cost and dependencies. | Coordinate the switch design with facility supply, return, heat-exchanger, redundancy, and failure-response requirements. |
| Immersion cooling | Can provide greater capacity and support higher equipment density. | Fluid and pump reliability, optical and fiber-connector hermeticity, and cost are concerns. | Requires significant equipment redesign. Verify optical interfaces, service procedures, materials compatibility, and system-level reliability before selecting it. |
These descriptions are a framework baseline, not a current vendor comparison or endorsement. Select an architecture only after the facility team and equipment supplier have aligned on heat rejection, redundancy, and service conditions. A cooling solution that removes enough heat in steady state may still be unsuitable if a pump, fan array, external supply, or heat exchanger fails in a way the system cannot tolerate.
Use a common comparison worksheet for each candidate. First state the heat load and the component temperature limits the design must meet; then identify the cooling path and the facility equipment needed to reject that heat. Add the service and reliability implications: whether a fan array is hot-swappable, whether a pump is a single point of dependency, whether external liquid serves multiple units, and what happens during a supply or heat-exchanger interruption. Finally, compare acoustic constraints, deployment maturity, redesign effort, and total cost. The framework provides qualitative trade-offs, not a cost model or a current product ranking, so obtain project-specific infrastructure and lifecycle costs from the relevant suppliers.
There is no architecture choice that follows from CPO alone. Air may be the familiar and lower-cost route in a suitable thermal envelope, while liquid or immersion options may offer additional capacity or density with added infrastructure and reliability requirements. The decision should follow validated component limits and facility capability rather than an assumption that the newest packaging automatically requires one cooling method.
How to manage heat inside the package
Package-level thermal coupling is a separate design problem from removing heat from the chassis. A high-power ASIC and optical engines share package area, increasing thermal density and creating the possibility that heat from one component will raise the temperature of another. The relevant concern is not only each component’s peak temperature but also whether the thermal path and gradients remain compatible with the optical and electrical operating limits.
An IEEE Photonics Technology Council Co-Packaged Optics presentation discusses several approaches: separate heat paths for ASIC and optics, heat sinks with greater surface area, airflow, thermal interface materials, and thermally conductive package vias. These are design options, not proof that any specific combination will work in a given switch. Package geometry, component limits, and system integration determine what is practical.
When reviewing a package proposal, ask where heat is generated, how it conducts away from each source, and whether one source warms another. A distinct heat path or thermal isolation may help address coupling, while greater heat-sink surface area, airflow, interface materials, or conductive vias are possible tools described by the IEEE presentation. Their suitability depends on the assembly; the presence of one technique in a design is not evidence by itself that the optical engines remain within their required operating envelope. Request vendor package-level information and test the assembled system.
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One 2024 IEEE conference paper reports a liquid-cooled CPO design tested at 290 W input power. In that experiment, the ASIC junction temperature was 51 °C, optical-chip temperatures were 28 °C to 29 °C, and the maximum temperature difference was 0.6 °C. Those are results for the paper’s particular design and test conditions, not standard targets, universal limits, or promised performance for another assembly. See the 2024 IEEE paper on liquid-cooled heat dissipation for CPO over 12.8 Tbps.
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Random freezes, missing sound and display glitches usually trace back to one bad driver. Find and replace yours safely.Free scan · under a minuteDo not turn those laboratory values into acceptance criteria for a different switch. The result demonstrates a specific liquid-cooled design and experiment; it does not define the temperature rating of other ASICs or optical engines, nor a facility inlet or coolant setpoint. For a deployment decision, the relevant limits and allowable gradients must come from the vendors for the specified hardware and be checked under the project’s operating conditions.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.What information should you request from vendors?
Request component-level data early enough to influence the package and cooling design. A system-level wattage or a single maximum-temperature number is not sufficient to assess thermal coupling, derating, and failure behavior. Ask the switch and optical-engine suppliers for the following project inputs:
- Power for each component across operating modes, including maximum and representative cases, and a clear statement of what each figure includes.
- Maximum rated temperatures, derating behavior, and any allowable thermal gradients for the ASIC, optical engines, and laser sources.
- Heat-source locations and package-level thermal information needed to assess conduction paths and interactions between ASIC and optics.
- Cooling-interface requirements, including relevant pressure-drop or airflow constraints, and the permitted operating conditions for the proposed cooling method.
- Optical-performance limits over temperature and the system response if cooling performance is degraded or interrupted.
- Redundancy and failure behavior for fans, pumps, liquid supply, heat exchangers, and power conversion, as applicable to the selected architecture.
Do not treat a requested value as established until the vendor supplies it for the specified hardware and operating conditions. The reviewed OIF framework and research demonstrations do not provide product-specific limits for an unspecified switch.
Make the request specific to the proposed configuration: identify the ASIC and optical-engine count, laser arrangement, cooling method, and inlet or ambient range under consideration. Ask suppliers to distinguish the maximum rated condition from a typical operating point and to describe how temperature or power changes with operating mode. For a liquid proposal, obtain the interface and pressure-drop requirements needed to coordinate the switch with the facility system; for an air-cooled proposal, establish airflow constraints and fan assumptions. These are design inputs, not values that can be inferred from a generic CPO reference.
How to validate the complete design
Validation should cover the configured assembly and the facility operating envelope, not just a component on a bench. Test representative and worst-case traffic at the ambient conditions the deployment must support. Measure the system draw and the conditions at the cooling interface so that a thermal result can be traced to the actual load and cooling state.
- Freeze the test boundary. List the switch configuration and every included load, from ASIC and optics through fans or pumps and conversion stages. State separately whether rack or facility cooling is included.
- Define operating cases. Include representative traffic and the maximum traffic case required by the project, along with the high ambient or inlet condition and redundancy state the design is expected to handle.
- Instrument the assembly and cooling path. Measure package and component temperatures, inlet and exhaust air or coolant conditions, fan or pump power, and total system draw.
- Check limits and gradients against vendor data. Evaluate component temperatures, derating, optical performance, and thermal interaction against the limits supplied for that hardware rather than against a generic CPO temperature target.
- Exercise failure and recovery conditions. Where relevant to the chosen architecture, verify the system response to reduced airflow, pump or supply interruption, or loss of a cooling component, using the project’s reliability requirements.
- Reconcile measured and budgeted power. Identify differences between component sums and system draw, document the conditions behind each result, and update the thermal budget before finalizing facility capacity.
The sources establish no universal CPO temperature setpoint. The acceptance criteria must come from the equipment specifications and the project’s operating and reliability requirements, then be validated on the complete assembly.
Keep the results useful for procurement and operations by documenting the hardware configuration, test boundary, ambient and cooling conditions, traffic case, measured power, and component temperatures together. A temperature number without those conditions is difficult to compare with a supplier rating or a later test. If the test reveals a thermal or power discrepancy, revisit the budget and cooling assumptions before committing facility capacity; do not resolve the difference by applying an unrelated published percentage or demonstration temperature.
Frequently Asked Questions
How do you cool a co-packaged optics switch?
Start with the ASIC and optical-engine temperature limits and package heat paths supplied by the vendors, then select air, closed-loop liquid, open-loop liquid, or immersion cooling based on heat-removal capacity, reliability, facility infrastructure, serviceability, and cost. Validate the complete configured system under representative and worst-case operating conditions; there is no universal CPO cooling setpoint.
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There is no universal CPO switch power figure. It depends on the ASIC, optical engines, laser architecture, configuration, operating modes, and included system loads. OIF’s 2020 representative 12.8 Tb/s 1RU example lists 900 W typical and 1,500 W worst-case total consumption, but it is not a CPO product specification. Obtain figures for the actual switch and define whether fans, pumps, conversion losses, and facility cooling are included.
Does co-packaged optics reduce switch power?
It can, but reported savings depend on the comparison boundary and technology generation. Alan F. Evans’s 2026 analysis estimates switch-power reductions of 18% versus LPO links and 36% versus DSP links, while reporting different efficiency improvements for transceiver-only comparisons and comparisons that include host SerDes. Treat these as scoped estimates, not guaranteed savings for a deployment.
What is a safe operating temperature for CPO optics?
No universal safe temperature is established for all CPO switches. Request the maximum rated temperatures, derating behavior, allowable gradients, and optical-performance limits for the specific ASIC, optical engines, and laser sources, then validate them in the complete assembly.
Can I use the 2024 liquid-cooled demonstration temperatures as design targets?
No. The 2024 IEEE paper reports results for one design tested at 290 W input power, including a 51 °C ASIC junction temperature and optical-chip temperatures of 28 °C to 29 °C. Those experimental results are not universal limits or guaranteed performance for another switch.
The Bottom Line
Plan CPO switch cooling from a clearly bounded power budget, vendor-specific component limits, package heat paths, and facility capability. Compare cooling options on capacity, reliability, infrastructure, serviceability, and cost, then validate the complete system at representative and worst-case conditions. Published efficiency percentages and laboratory temperatures are useful context, not substitute specifications.
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