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XMEMS says its XMC-2400 solid-state cooling chip is now in mass production and shipping to support its first glasses design wins. That does not mean cooling chips for smartphones and data centers are also shipping at scale: those are listed as intended applications for the company’s broader µCooling portfolio, not confirmed deployments in the July 2026 announcement.
What XMEMS has actually put into production
In a July 21, 2026 announcement, XMEMS identified the XMC-2400 as its first µCooling device in mass production and said it was shipping to support its first glasses design wins. The company did not name the glasses makers or disclose production volumes. XMEMS’s announcement is specific to the XMC-2400 and glasses; it is not evidence that smartphone or data-center products using the technology are already in mass production.
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A separate model, the XMC-1200, was introduced for smart-glasses components such as AR/XR light engines and processors. XMEMS said engineering samples were available to qualified customers under NDA, with production readiness targeted for Q4 2027. The XMC-4800 appears on the company’s portfolio page for uses including smartphones and data-center SSDs, but that page does not state that the model is in mass production.
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1Clear out junk files and repair common Windows errors2Fix the driver behind crashes, sound loss and screen glitches3Repair Windows errors before they cause bigger problemsAndroid Central reported on an XMC-2400 demonstration and said an xMEMS thermal-management executive expected a consumer product featuring the chip by the end of 2026. That is a reported forecast, not a confirmed launch date or a named product. Android Central’s report does not establish a retail release.
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How a chip can move cooling air
µCooling is xMEMS’s name for an all-silicon, solid-state active-cooling component. The company describes a thin-film piezoelectric material moving silicon membranes at ultrasonic frequencies. Those membranes create air pulses through micro-valve arrays, while vents in the package direct airflow toward a hot component. The aim is localized forced-air cooling in devices where a conventional fan may be too large.
Unlike a conventional fan, the design has no rotating blades. XMEMS describes it as silent and vibration-free; those are manufacturer claims, not independently verified measurements of noise, vibration, cooling effectiveness or reliability in a finished device. The company’s explanation and portfolio are on its µCooling product page.
Rank #2
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How the three models differ
The models have different stated target applications and readiness levels. Their published figures are not a uniform, independent head-to-head test, so airflow or power values should not be treated as a direct measure of which chip will cool a particular finished product best.
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| Model | Target use and status | Published size | Airflow and back pressure | Power or performance figure |
|---|---|---|---|---|
| XMC-1200 | AR/XR light engines, processors and other smart-glasses components. Engineering samples available under NDA to qualified customers; production readiness targeted for Q4 2027, according to xMEMS. | 46 mm² area, according to xMEMS; dimensions not stated in the cited announcement. | Not stated in the cited announcement. | Paired with an Astra2 drive ASIC, xMEMS reports typical system power of 70 mW and up to a 10°C temperature reduction at a 1 W thermal load. These are company-reported figures. |
| XMC-2400 | XR glasses, personal SSDs and edge-AI applications on the product page. XMEMS says it is in mass production and shipping to support its first glasses design wins. | 7.42 × 9.48 × 1.13 mm, according to the product page. | Up to 28 cc/s airflow and up to 1,300 Pa back pressure, according to the product page. | About 150 mW, according to the product page. |
| XMC-4800 | Listed for data-center SSDs and smartphones. The product page does not state that it is in mass production. | 9.93 × 14.35 × 1.13 mm, according to the product page. | Up to 48 cc/s (0.1 CFM) airflow and up to 1,100 Pa back pressure, according to the product page. | About 240 mW, according to the product page. |
Specifications for the XMC-2400 and XMC-4800 come from xMEMS’s portfolio page; XMC-1200 status and performance figures come from the July 2026 announcement. “Up to” figures are stated maxima, not guaranteed airflow or cooling in every device. The XMC-1200’s reported temperature reduction is tied to its specified 1 W thermal-load setup and Astra2 pairing.
Rank #3
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What the smartphone and data-center claims mean
xMEMS lists smartphones and tablets, personal and data-center SSDs, OSFP optical transceivers, DDR5 DRAM, PCIe retimers and voltage-regulator modules among possible µCooling applications. These are target applications or subsystems, not proof that a named phone, server or data-center product is using the chips commercially.
The distinction matters because a component’s presence in a product portfolio is not the same as a customer design win, a shipping device or volume deployment. The July 2026 release confirms glasses design wins for the XMC-2400 but does not identify customers; the available company materials do not establish smartphone or data-center customers shipping µCooling-equipped products.
Rank #4
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- 【IP65 Waterproof & Long Battery Life】 AI glasses are designed for daily wear with IP65 waterproof protection against sweat, rain, and dust. The built-in 290mAh battery provides reliable performance for workdays and travel—no anxiety when you’re on the go.
- 【Smart App Control & Object Recognition】Smart glasses connect to the companion app for easy setup, file management, and feature control. They support AI object recognition to help identify items and improve your daily efficiency—perfect for travel exploration and a smart lifestyle.
How strong is the evidence for cooling performance?
The public figures in the 2026 announcement and product page are manufacturer specifications and claims. They do not provide an independent, comparable benchmark across the XMC-1200, XMC-2400 and XMC-4800 or establish how much a finished phone, glasses frame or server component will cool under a particular workload.
In a June 2025 announcement about an XR-glasses application, xMEMS reported modeling and physical-verification results for a 1.5 W setup: a 60–70% improvement in power overhead, up to 0.6 W of additional thermal margin, up to 40% lower system temperatures and up to 75% lower thermal resistance. These are the company’s results for that stated setup, not independent tests or a general guarantee for later products. The announcement is available in xMEMS’s June 2025 release.
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What consumers can do with the announcement
These are OEM components intended to be integrated into device designs, not established retail retrofit accessories. XMEMS directs prospective evaluators to request samples or contact the company; its cited materials do not establish a consumer-compatible chip listing or an off-the-shelf upgrade for existing glasses, phones or computers. For consumers, the practical near-term signal is that XMC-2400 is moving through glasses design wins—not that a cooling chip can be added to a device already in use.
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