A pre-release Geekbench 6 entry for Honor’s Win2 (model BRM-AN00) identifies Qualcomm platform QTI SM8975 and records 4,141 points in single-core, 11,514 in multi-core and 34,695 in OpenCL GPU testing. Secondary reporting maps that platform and its eight-core layout to the Snapdragon 8 Elite Extreme Gen 6. The mapping is strong pre-launch evidence, but it is not yet a final retail specification from Honor.
What the Geekbench listing reveals
The database entry is for the BRM-AN00, a model number associated with the Honor Win2. It ran Geekbench 6 on Android 17 and showed about 14.82GB of available memory. Because operating-system overhead reduces the amount reported as available, that figure is generally consistent with a 16GB RAM configuration rather than a phone physically containing only 14.82GB.
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| Test or field | Reported result | How to read it |
|---|---|---|
| Single-core | 4,141 | Performance of one CPU core in Geekbench 6 |
| Multi-core | 11,514 | Combined CPU performance across the listed cores in Geekbench 6 |
| OpenCL GPU | 34,695 | Compute result using the OpenCL workload, not a game frame-rate test |
| Operating system | Android 17 | Software shown in this pre-release run |
| Available memory | Approximately 14.82GB | Likely a 16GB RAM tier after system-reserved memory is excluded |
These are Geekbench 6 numbers. Geekbench recommends its newer Geekbench 7 benchmark for modern hardware, so the Win2 scores should not be compared directly with Geekbench 7 results. A meaningful comparison requires the same Geekbench generation, comparable firmware and the same workload type.
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The listing’s platform field says QTI SM8975. Reports examining that identifier and the phone’s eight-core arrangement interpret it as the Snapdragon 8 Elite Extreme Gen 6. Honor’s 13 October 2026 technology briefing also described the WIN2 series as among the first devices to use the sixth-generation Snapdragon 8 flagship chip.
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That identification should still be described as a pre-launch interpretation. The benchmark record is not a final retail specification sheet, and no independent process-node document was established for the often-repeated “2nm” description. Until Honor publishes the commercial specification or the phone reaches retail testing, the chipset name and manufacturing-node claim should be treated with different confidence levels: SM8975 is the observed platform identifier, while the Snapdragon branding is the reported mapping.
Expected launch date and China configurations
Launch coverage places the China presentation on 21 October 2026. Honor had opened China pre-orders before that event, and reported storage and memory combinations were:
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| RAM | Storage |
|---|---|
| 12GB | 256GB |
| 16GB | 256GB |
| 12GB | 512GB |
| 16GB | 512GB |
| 16GB | 1TB |
The Geekbench run therefore appears compatible with one of the 16GB variants, but it does not identify the storage capacity and cannot prove that every listed configuration uses identical clocks, cooling or firmware.
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Why dual-fan cooling matters
At the 13 October technology briefing, Honor announced dual-fan cooling for the WIN2 series. That is relevant to a high-end chipset because short benchmark bursts and sustained workloads measure different things. A phone can post a high peak score and then reduce clock speeds as heat builds; larger or actively assisted cooling can help it hold performance for longer during gaming, video export or other repeated workloads.
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The Geekbench entry itself is a snapshot, not a sustained thermal test. It does not establish fan noise, surface temperature, battery impact or long-session performance. Those questions require retail hardware and controlled repeated runs.
How to compare the Win2’s numbers fairly
- Match the benchmark version. Compare Geekbench 6 with Geekbench 6, or Geekbench 7 with Geekbench 7; do not mix generations.
- Separate CPU and GPU results. Single-core and multi-core are CPU tests, while the 34,695 figure is an OpenCL compute result and is not a gaming benchmark.
- Check software status. Pre-release firmware can change scheduler behavior, drivers and thermal limits before retail launch.
- Use the same memory and storage tier where possible. Different capacities or chip configurations can affect results.
- Look for sustained testing. Repeated runs, cooling conditions and throttling matter more for long workloads than one database submission.
- Confirm market and price. The reported date and configurations concern China; global availability, regional network compatibility and final pricing were not established.
What remains unconfirmed
- A final Honor retail specification naming the Snapdragon 8 Elite Extreme Gen 6.
- The alleged 2nm manufacturing process.
- Whether every Win2 configuration receives the same CPU and GPU frequencies.
- Global launch timing, international model numbers and network-band support.
- Retail price, Amazon inventory and availability outside China.
- Final performance after commercial firmware updates.
In short, BRM-AN00’s Geekbench 6 listing provides concrete evidence of a very high-end platform: 4,141 single-core, 11,514 multi-core and 34,695 OpenCL points, with Android 17 and memory reporting consistent with 16GB RAM. QTI SM8975 is being identified in launch coverage as Snapdragon 8 Elite Extreme Gen 6, while Honor’s announced dual-fan design suggests attention to sustained cooling. The 21 October 2026 China launch is the next point at which the chipset, configurations and other specifications can be checked against final retail hardware.
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