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Clear out junk files and repair common Windows errorsFree Scan →Scan for outdated or missing drivers - takes under a minuteDriver Scan →Repair Windows errors before they cause bigger problemsFix Now →Automated X-ray inspection (AXI) uses X-ray images and software to examine internal or concealed features of manufactured parts. In electronics production, it is commonly used to inspect solder joints and other hidden features on printed circuit board assemblies (PCBAs). AXI provides evidence about physical structure; it does not, by itself, prove that an assembly works electrically as intended.
How automated X-ray inspection works
In an electronics AXI system, the assembly is exposed to an X-ray beam inside an enclosure designed to contain radiation. A detector records the X-rays that pass through the target. Differences in material density and thickness create variations in the resulting image, which software evaluates against an inspection program.
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Detector designs vary. For example, a system may convert X-rays to visible light with a scintillator and camera, or record them with a direct sensor array; these are alternative approaches, not features shared by every machine. GÖPEL electronic describes automated loading, inspection, evaluation and result logging as part of an AXI workflow. See GÖPEL electronic’s AXI overview.
What AXI can inspect
AXI is useful when components or board geometry conceal features from ordinary optical inspection. Electronics applications include solder joints associated with BGA, QFN, QFP, LGA and through-hole components. Depending on equipment, geometry, program and inspection strategy, systems may look for misalignment, solder bridges or shorts, insufficient solder, voids and head-in-pillow connections.
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X-ray inspection is also used for some non-PCB applications. Nordson describes examples involving semiconductor assemblies, automotive and aerospace sensors, castings and medical parts; these are examples of applications, not evidence of how common AXI is across those industries. Nordson’s application overview describes its examples.
2D, 2.5D and 3D imaging compared
| Imaging approach | How it works | What it helps with | Tradeoff |
|---|---|---|---|
| 2D | A vertical radiographic projection | Provides a projected image for inspection | Overlapping features, especially on dense or double-sided boards, can make interpretation difficult. |
| 2.5D | Adds oblique X-ray projections | Additional viewing angles can help assess features such as through-hole solder penetration or BGA connections. | Some overlap limitations remain. |
| 3D | Software reconstructs a volume from multiple oblique images | Can help separate top- and bottom-side joints on double-sided boards. | Collecting multiple projections generally takes longer than capturing a single 2D or 2.5D image. |
These are technical tradeoffs, not a guarantee that 3D is always the right choice. Selection depends on the board, defects of interest, coverage requirements and production takt time. GÖPEL says its inline 3D image calculation typically uses 8–16 oblique images with digital area detectors. It gives approximately 3–5 seconds for a standard 3D image field with eight projections, while noting placement may require more projections. Those are vendor-specific examples, not general performance benchmarks.
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Where AXI sits in a production line
AXI may be installed inline as part of a production line or used offline at a separate inspection station. Inspection can cover all components or focus on selected hidden joints while optical inspection checks other features. The choice depends on required coverage, assembly design and cycle-time constraints; inline/offline placement and full/selected coverage are distinct decisions.
AXI adds structural evidence to other quality checks rather than replacing them. An IPC paper presented at IPC SMEMA Council APEX in 2002 described AXI coverage as complementary to flying-probe, in-circuit and functional tests. X-ray images can reveal physical joint defects, but an image inspection alone does not establish electrical function.
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Limits, setup and process control
Images do not guarantee reliable results
Board geometry and overlapping features can limit what an image reveals. Inspection programs also need setup and parameterization. An IPC paper from 2002 discusses false failures, defect escapes and uptime as process measures to monitor, and distinguishes improving upstream assembly processes using AXI data from improving the inspection process itself. Its observations are historical process guidance, not a current benchmark for machine performance.
Radiation controls are part of deployment
GÖPEL describes radiation-tight chambers and safety interlocks for its X-ray facilities, along with trained operators. These are vendor statements about its installations. Anyone specifying or operating equipment should verify current local regulations, installation approvals and training requirements for the particular machine and jurisdiction.
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- Material: The main unit casing is made of brushed aluminum alloy with a unique groove design and equipped with multiple axial fans for better heat dissipation.
- LED Beads: Utilizes rationally arranged cold-light source LED beads to ensure uniform illumination without damaging the film. Maximum brightness: 260,000 Lux (90,000 cd/m2).
- Ease of Use: The observer is equipped with intuitive control buttons for quick and easy adjustment of light intensity, allowing operators to adjust according to different film thicknesses and inspection needs.
- Portability: This observer features a lightweight and compact design, making it easy to carry to various work locations.
- Service: If you have any questions, please feel to contact us and we will reply within 24 hours!
Standards context
DIN Media’s catalog listing says IPC 9716A, published April 1, 2026, adds specific requirements for automated inspection process control for printed-board assembly processes to the generic IPC 9711 requirements. The listing names solder-paste inspection, AOI and AXI as example inspection systems. The catalog summary describes scope; it is not a substitute for the full standard text. View the DIN Media listing for IPC 9716A.
What to assess when selecting an AXI setup
There is no normalized, independent comparison of AXI models or specifications here. For a system evaluation, define the inspection need first, then assess:
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- Whether 2D, 2.5D or 3D imaging can detect the target features on the actual board design.
- Package types and defect categories the system and inspection program are intended to cover.
- How double-sided boards and overlapping features will be handled.
- Whether inline or offline installation fits the production flow and cycle time.
- Image-acquisition method, inspection-program setup and result traceability.
- Site-specific radiation protection, installation approval, operator training and service needs.
Use sample assemblies and agreed acceptance criteria to validate coverage and false-call handling in the intended process; do not infer performance from an imaging label or a vendor’s example cycle time alone.
Quick Recap
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