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Outbyte Driver Updater FREEScan for outdated or missing drivers - takes under a minuteDriver Scan →Outbyte PC Repair FREERepair Windows errors before they cause bigger problemsFix Now →AMD CEO Lisa Su was expected in Seoul on October 7, 2026, but reporting available that morning did not confirm that she had met Samsung’s chip leadership or that the companies had announced a new deal. The confirmed foundation for their cooperation is a March 18 memorandum of understanding covering HBM4 supply alignment for AMD’s MI455X accelerator, memory collaboration for EPYC processors and Helios systems, and further discussion of possible Samsung foundry services.
Was Lisa Su meeting Samsung’s chip chief?
Su was scheduled to attend AMD Gamer Day in Seoul on Wednesday, October 7, with a media Q&A also planned. Aju Press reported that meetings with Korean AI-chip companies and government officials were expected. Seoul Economic Daily said companies, including Samsung, could not confirm specific meeting schedules. As of the morning of October 7, the cited coverage did not establish that a meeting with Samsung leadership had taken place. Aju Press’s October 6 report and Seoul Economic Daily’s September 30 report describe anticipated developments, not a confirmed meeting or new agreement.
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What AMD and Samsung have already agreed to discuss
On March 18, 2026, Samsung and AMD announced a memorandum of understanding at Samsung’s Pyeongtaek complex. The MOU sets out three cooperation tracks:
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- HBM4 for MI455X: Samsung is to align with AMD on supplying HBM4 as a primary memory solution for AMD’s next-generation MI455X accelerator.
- Memory for EPYC and Helios: The companies plan to collaborate on memory solutions for AMD’s sixth-generation EPYC processor, codenamed “Venice,” and DDR5 for the Helios rack-scale platform.
- Possible foundry services: Samsung and AMD said they would discuss potential Samsung foundry services for future AMD products.
The MOU signals a broader working relationship, but it is not evidence of a newly announced binding supply contract or a Samsung foundry manufacturing award. The scope and status of these tracks are described in Samsung’s March 18 announcement.
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Why memory supply matters to AMD’s AI plans
AI accelerators need high-bandwidth memory to move data to and from processors quickly. That makes access to HBM a strategic part of building AI systems, alongside the accelerator itself and the broader platform around it. Samsung’s announcement positions MI455X within AMD’s Helios rack-scale architecture and describes HBM4 as intended for next-generation AI training and inference systems.
Samsung says its HBM4 uses 1c-class DRAM and a 4nm logic base die, with speeds of up to 13 Gbps and maximum bandwidth of 3.3 TB/s. Those are Samsung-published product specifications, not independently verified comparative test results. Samsung’s announcement gives the specifications and their intended context.
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Component availability is also a disclosed business risk for AMD. In its August 4, 2026 second-quarter results release, the company listed the availability of essential components, including memory supply, among factors that could cause actual results to differ materially from expectations. That filing does not disclose AMD’s current memory inventory, allocations or a specific supply forecast. AMD’s second-quarter results release supports the risk, not a claim about the company’s precise supply position.
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How long could the memory crunch last?
Seoul Economic Daily reported that TrendForce expected memory shortages could continue through 2027, citing growing AI-server investment and competition for manufacturing capacity between HBM and conventional DRAM. This is a reported forecast, not a confirmed timeline or guarantee that shortages will last until then. The cited coverage does not provide TrendForce’s underlying methodology or numerical supply-demand estimates.
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What a new Samsung meeting would—and would not—tell us
A meeting during Su’s Seoul visit would be evidence of continued engagement, but by itself would not establish a new supply commitment, production allocation or foundry award. The distinction matters because the March MOU already covers HBM4 alignment and memory collaboration while leaving foundry services for discussion. Any claim of a new agreement requires a company announcement or reporting that confirms its terms.
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