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xMEMS’ XMC-2400 is a solid-state air pump made with silicon MEMS technology—not a tiny fan with spinning blades. Announced in August 2024 for phones, SSDs, XR devices and other space-constrained electronics, it uses vibrating membranes and micro-valves to push air near hot components. As of xMEMS’ July 2026 announcement, the company says the XMC-2400 is in mass production and shipping for its first glasses design wins. That is progress toward commercial use, not evidence of a broadly available consumer product.
What xMEMS introduced
On August 20, 2024, xMEMS announced the XMC-2400 µCooling device, an approximately 1 mm-thick, all-silicon active micro-cooling component. The company’s “fan-on-a-chip” label is an accessible shorthand: the XMC-2400 does not use a conventional rotating impeller. It is designed to create directed airflow in products where a standard fan may not fit or may bring unwanted noise and vibration.
The original announcement named smartphones, tablets, laptops and handheld PCs, M.2 and enterprise SSDs, XR devices, optical transceivers and other compact electronics as potential applications. These are target markets, not a list of confirmed products that shipped with the component.
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xMEMS describes a process in which thin-film piezoelectric material on silicon drives small MEMS membranes. When electrical signals make those membranes expand and contract at ultrasonic frequencies, they produce pressure pulses. Arrays of micro-valves direct the pulses into airflow. The device can be packaged to send air through top vents, side vents or a product’s ducting.
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- Linear damping telescopic clip: easy to adjust, pay attention! Suitable for all types of mobile phones with a width of "6 to 7.5 centimeters". NEVEIKIA mobile phone cooling can cool down when connected to a power source.（Attention: It is best to remove the phone case when using it for a better experience!）
- Quick cooling: Dual engine, cooling principle is the same as a refrigerator, not ordinary fan cooling. It can cool your phone in "3 to 5 seconds", avoiding overheating and ensuring a stable live streaming or gaming experience.
- Dual power supply design: supports powering the radiator through a mobile phone, and can also be connected to an external power source for use; When connected to an external power source, it can provide stable power to both the radiator and the phone, avoiding interruption of heat dissipation due to insufficient power during long-term use and ensuring continuous and stable heat dissipation performance.
- Silent engine cooling: The fan with dual silent design can effectively dissipate air from all directions, providing stronger cooling effect without interfering with your games or Vlog programs.
- Expanded cooling area: Approximately 2.82x1.29 inches of extreme thermal conductivity cooling area, covering the CPU and battery module, protecting your phone from blackening or sudden shutdown.
- Electrical drive: The host system supplies power and control signals. xMEMS describes an XMC-2400 implementation using approximately 3 V and I²C commands.
- Membrane motion: Piezoelectric actuation flexes the membranes at frequencies above the human hearing range, according to xMEMS.
- Airflow generation: Pressure pulses and micro-valves produce directed air movement; xMEMS says airflow direction can be reversed through an I²C command.
- System integration: The air must be routed across or near the intended heat-rejection surface, then have a path to exhaust or recirculate appropriately.
The company says the device can be surface-mounted on rigid or flexible circuit boards and that multiple units can be arranged in parallel for more airflow or stacked to increase static-pressure capability. “On-chip” describes the silicon MEMS cooling component; it does not mean the device necessarily sits directly on a processor die. A working design still needs a thermal path from the heat source and a suitable airflow path.
What the original 2024 specifications said
The following figures are from xMEMS’ August 2024 XMC-2400 announcement. They should be read as launch-era company specifications, not blended with figures on the company’s current product page.
| Specification | August 2024 XMC-2400 announcement |
|---|---|
| Dimensions | 9.26 × 7.6 × 1.08 mm |
| Weight | Less than 150 mg |
| Airflow | Up to 39 cm³/s |
| Back pressure | 1,000 Pa |
| Construction | All-silicon, solid-state |
| Acoustics | xMEMS described it as silent and vibration-free |
| Environmental rating | IP58 |
| Sampling plan at launch | Q1 2025 |
xMEMS’ original announcement also compared the device’s size and weight with non-silicon active-cooling alternatives. Such comparisons depend on what products and configurations are used as the baseline, so they are not a universal measure of how much smaller every cooling system will be.
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xMEMS’ current µCooling page lists three products and figures that differ from the 2024 XMC-2400 launch specifications. Because the company does not explain the differences in the reviewed material, it is unclear whether they reflect a revised package, a different operating condition, a product revision or updated characterization. Treat them as separately published figures rather than combining them.
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- ENHANCED HEATSINK FOR FASTER COOLING – Built with a larger internal heatsink (1 × 1 inch), this phone radiator delivers significantly improved heat dissipation compared to standard models. The aluminum alloy thermal core accelerates cooling efficiency, helping maintain stable device performance even during long gaming or streaming sessions.
- STRONG MAGNETIC ATTACHMENT & OPTIONAL STICKER SUPPORT – Designed with high-strength magnetic suction, this cooler securely attaches to the back of compatible devices. For phones or tablets without built-in magnets, it includes magnetic stickers to ensure firm attachment—especially useful during intense gaming or extended usage.
- DETACHABLE CLIP WITH CLOUD CONNECTION PORT – The adjustable clip-on arm expands up to 4 inches (10 cm) and now features an added port for connecting to a cloud gaming platform, making it easier to pair with gamepads or streaming accessories. Whether clipped or magnet-mounted, it offers a reliable hold on iPhone, Android, and tablet devices.
- 3 FAN SPEEDS WITH RGB TEMP DISPLAY – Offers three fan speed modes and a digital screen that displays real-time cooling temperature. The integrated RGB lighting reacts to temperature levels while maintaining low-noise operation, ensuring immersive gameplay, streaming, or calls without disturbance.
- PERFECT FOR GAMING, VIDEO CALLS, AND CREATIVE USE – Simply plug in the included Type-C cable to activate cooling. Whether gaming, broadcasting live, video conferencing, or vlogging, this compact cooler helps prevent thermal throttling and keeps your device cool and responsive throughout intensive use.
| Product | Listed applications | Dimensions | Airflow | Back pressure | Power |
|---|---|---|---|---|---|
| XMC-1200 | AI glasses, microdisplays, wearables, headphones | 5 × 8 × 1.14 mm | Up to 10 cm³/s | Up to 1,100 Pa | About 70 mW |
| XMC-2400 | XR glasses, personal SSDs, edge-AI applications | 7.42 × 9.48 × 1.13 mm | Up to 28 cm³/s | Up to 1,300 Pa | About 150 mW |
| XMC-4800 | Data-center SSDs and smartphones | 9.93 × 14.35 × 1.13 mm | Up to 48 cm³/s / 0.1 CFM | Up to 1,100 Pa | About 240 mW |
The current µCooling page also describes the broader platform as 1 mm thin, approximately 150 mW, capable of up to 48 cm³/s and rated IP68. Those platform-level descriptions should not be retroactively assigned to every XMC-2400 configuration or to the 2024 announcement.
Why targeted airflow can matter in a thin device
A micro-cooler’s appeal is not maximum air volume. It is the possibility of placing forced airflow close to a concentrated hot spot when a larger fan cannot fit. That could help designers move heat away from a processor, SSD controller, optical module or microdisplay without relying solely on a broad stream of enclosure air.
But airflow is only one part of cooling. A practical thermal path is heat source → thermal interface or spreader → air channel or duct → exhaust and ambient. If heat cannot reach a surface the moving air can cool, the air pump will not solve the problem. Likewise, in a sealed enclosure, moving internal air around does not remove heat unless the design also transfers it to a surface or heat exchanger that can reject it.
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Random freezes, missing sound and display glitches usually trace back to one bad driver. Find and replace yours safely.Free scan · under a minutexMEMS says its µCooling technology can reduce temperatures by 10–20°C in some constrained data-center applications and advertises an immediate reduction of up to 30°C versus passive cooling in an AI-glasses demonstration. These are company-reported results, not independent benchmarks. The cited material does not establish a common test load, ambient temperature, measurement point, duration, airflow path or passive-cooling baseline for those numbers. They should not be treated as a predicted temperature drop in a finished phone, pair of glasses or SSD.
Rank #3
- 【20W Power Ultra-Fast Cooling】The wired magnetic phone cooler utilizes high-performance Peltier element (TEC) with high heat dissipation capacity, and its heat dissipation ability lowers the temperature of the main unit by about 95℉. NOTE: Connection to power supply required for use. Power must exceed 20W for optimal performance. Data cable not included in packag.
- 【Simple Control】The cell phone cooling fan has a built-in Type-C interface, just connect the power cord and it is ready to use. Switch between overclocking mode and silent mode with the click of a button. 12N strong magnetic force holds the phone firmly in place and prevents it from falling off.
- 【Compact and lightweight design】The Magnetic cell phone cooler weighs only 0.18 lb in a small size, leaving more space for hand operation and being without overheavy burden.
- 【Quiet Operation】This smartphone cooler adopts noise reduction design, and the operating noise in silent mode is only 30db, allowing you to play games or watch videos comfortably.
- 【Vertical Air Duct Design】The vertical air duct design of FunCooler 5 smartphone cooling fan focuses on the user's actual experience and innovative ergonomic design, which provides a comfortable grip and does not dissipate heat to the hand.
What has happened since the 2024 announcement?
The original announcement said customer sampling was planned for Q1 2025. In an announcement dated July 21, 2026, xMEMS said the XMC-2400 was in mass production and shipping for its first glasses design wins. That is a later commercial milestone, but the company announcement does not identify a named consumer product or establish broad retail availability.
That July 2026 announcement also introduced the smaller XMC-1200 for smart glasses and other wearables. xMEMS says engineering samples are available to qualified customers under NDA, with production readiness targeted for Q4 2027. These are distinct milestones: engineering samples are not the same as mass production, and shipping a component for a design win does not mean consumers can buy it separately.
xMEMS calls the XMC-1200 the “world’s smallest active micro fan” in its July 2026 announcement. That superlative is the company’s claim, not an independently established ranking.
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Where it may fit—and where it may not
µCooling is most plausible when the design has a concentrated heat source, is severely limited in thickness, and can accommodate vents or ducts near a suitable thermal interface. Wearables, compact storage devices and optical or edge-computing modules are examples of products where a designer might evaluate such an approach. xMEMS’ target applications do not, by themselves, prove that it is the best choice for each one.
Rank #4
- Rapid Cooling Down: It's the same refrigeration principle as the refrigerator, not the ordinary fan cooling，it can cool down your phone in few minutes to avoid overheat and ensure stabilize your live streaming or gaming experience.
- Universal Compatibility: This phone cooler provides two installation options – magnetic attachment and back clip fixation, making it perfect for most phone sizes. Whether you prefer the convenient magnetic snap-on or the sturdy back clip, it's designed to suit your needs.
- Wired USB-C Powered — Requires 15W+ Adapter for Peak Performance: This is a plug-in phone cooling fan, not wireless. For maximum 32°C cooling and fast frost, use a 5V/3A or 15W+ USB-C power adapter (not included) and a 3A-rated cable. The included 2A cable works for everyday cooling.
- Mute Engine Dissipation: Silent designing fan can efficiently emit wind from all sides, providing a stronger refrigeration effect, no disturbance to your gaming or your Vlog show.
- Large Cooling Area & Plug and Play: About 4.65 sq. Inches extreme thermal conductive cooling area to cover the CPU and battery module, protecting your phone from blackening or sudden shut-off. Use the C-type cable(included), plug and play.
It may be a poor fit if the device has substantial distributed heat, no workable intake and exhaust route, or enough room for a conventional fan, heat pipe or larger heat spreader. A designer also needs to account for the driver and control electronics, power, mounting, duct geometry and manufacturing integration. Current listed power is about 70 mW for XMC-1200 and 150 mW for XMC-2400—modest in many systems, but meaningful in a battery-powered wearable.
Published peak airflow is not the airflow a product will necessarily receive. A restrictive duct or vent creates back pressure, and delivered flow depends on the operating point and geometry. Dust, skin oils, condensation and debris are sensible design concerns for very small vents, especially in wearables, but the available material does not document these as observed XMC-2400 failures. Likewise, an IP rating and solid-state construction do not by themselves prove system-level reliability after blocked vents, sweat exposure, thermal cycling or shock.
How it compares with other cooling approaches
- Graphite, copper and aluminum spreaders: Passive, thin and silent; they spread heat rather than actively moving air. They still need a surface or enclosure that can reject the heat.
- Vapor chambers and heat pipes: Useful for transporting heat to a larger dissipation area. They do not generate airflow, and still need room and a viable heat-rejection surface.
- Rotary micro-fans or blowers: A better fit when a design needs higher total airflow and has room for an impeller, motor, intake and exhaust. They introduce moving parts and may have acoustic, vibration, thickness and wear trade-offs.
- Liquid or two-phase systems: Can address higher heat loads in larger or more complex systems, but typically require more system integration than a tiny localized air pump.
- Other solid-state air pumps: Compare specific devices on airflow, pressure, power, package thickness, reliability and availability—not on the broad “solid-state” label alone.
There is no universal winner: a micro-cooler can complement a heat spreader or duct rather than replace it. The correct comparison is between complete thermal designs under the same heat load, ambient conditions and space constraints.
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The XMC-2400 is a component for OEM integration, not a plug-in phone cooler or a PC fan upgrade. The reviewed xMEMS material provides no public retail price or ordinary consumer purchase listing. xMEMS directs prospective customers to its µCooling product page; its July 2026 announcement says XMC-1200 engineering samples are available under NDA to qualified customers. A manufacturer evaluating the part would need to work through electrical, mechanical and thermal integration rather than simply install it as an accessory.
The practical verdict
xMEMS’ fan-on-a-chip is best understood as a specialized, silicon-based air pump for products where conventional cooling hardware is difficult to place. Its small package and non-rotating mechanism make it an interesting option for targeted cooling, and the company’s reported XMC-2400 production milestone moves the story beyond the original sample plan. But airflow figures and temperature demonstrations do not establish performance in an unspecified finished device. For consumers, there is no standalone XMC-2400 to buy; for product designers, the key question is whether the complete heat-transfer and airflow path makes the component worthwhile.
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