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The processor described in the original headline as the “Ryzen AI 370 HX” is AMD’s Ryzen AI 9 HX 370, the flagship mobile chip in the Ryzen AI 300 family, codenamed Strix Point. Its 2024 pre-release benchmark leak suggested a substantial improvement over AMD’s previous mobile processors, especially in multi-core CPU performance and integrated graphics. Later retail testing broadly supported that direction—but the results depend heavily on the laptop’s power limits, cooling, firmware, and memory.

What the Ryzen AI 9 HX 370 leak showed

The widely reported leak came from an ASUS TUF Gaming laptop and was attributed to a Bilibili user or event attendee. Screenshots or database entries reportedly showed approximately 2,544 points in Geekbench single-core and 14,158 points in multi-core.

These were pre-release results, not an AMD-published laboratory test or a final independent review. The complete laptop configuration, BIOS, firmware, memory setup, cooling behavior, and power mode were not fully established. Some early Strix Point testing may also have used restricted or silent laptop profiles, making direct comparisons less reliable.

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Result Single-core Multi-core Evidence
Ryzen AI 9 HX 370 leak Approximately 2,544 Approximately 14,158 Pre-release result
ASUS Zenbook S 16 retail review 2,845 14,102 Retail laptop testing

The similar multi-core figures are encouraging because they suggest the leak was directionally credible. They do not make the two scores a perfectly controlled comparison: the systems, benchmark versions, power profiles, and test conditions were different. Contemporary reports described the leak as roughly 20% faster than comparable previous-generation AMD mobile chips, but that percentage varied according to the selected comparison and workload. Tom’s Hardware reported on the leaked results, while TechRadar covered the reported performance uplift.

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Ryzen AI 9 HX 370 specifications

The HX 370 combines four large Zen 5 cores with eight denser Zen 5c cores. Together, they provide 12 cores and 24 threads. AMD lists boost clocks of up to 5.1 GHz, 12MB of L2 cache, 24MB of L3 cache, and a TSMC 4nm FinFET manufacturing process.

  • Architecture: 4 Zen 5 cores plus 8 Zen 5c cores
  • CPU configuration: 12 cores and 24 threads
  • Maximum boost: Up to 5.1 GHz
  • Default TDP: 28 W
  • Configurable power range: 15 W to 54 W
  • Integrated GPU: Radeon 890M
  • Codename: Strix Point
  • Product family: Ryzen AI 300 Series

See AMD’s official Ryzen AI 9 HX 370 specifications for the processor’s published features.

Why the gains looked impressive

The previous Ryzen 9 7940HS and 8945HS generations generally used eight full-size CPU cores. Strix Point adds four additional cores while targeting premium, relatively portable laptops. That gives the HX 370 more parallel capacity for compiling code, rendering, compression, virtual machines, and other multi-threaded tasks.

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The hybrid design is important. Zen 5c cores are smaller and denser than the primary Zen 5 cores, helping AMD fit more processing capacity into a mobile power envelope. They are not simply “slow cores”; the practical advantage is higher total throughput, although exact performance depends on the workload and the laptop’s sustained power limit.

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The other major change is the Radeon 890M integrated GPU. It is substantially more capable than the previous Radeon 780M in many tests, making the HX 370 unusually interesting for thin laptops that do not include a discrete graphics processor.

Retail testing broadly validated the leak

Final hardware showed that the leak was not an implausible outlier. In its ASUS Zenbook S 16 testing, TechRadar recorded:

  • Geekbench 6.4 single-core: 2,845
  • Geekbench 6.4 multi-core: 14,102
  • Cinebench R23 single-core: 1,953
  • Cinebench R23 multi-core: 13,441
  • 3DMark Night Raid: 34,618
  • 3DMark Fire Strike: 8,516
  • 3DMark Time Spy: 4,407

The same review reported approximately 14 hours and 55 minutes in its movie-test battery methodology. That battery figure belongs to the specific Zenbook S 16 configuration and test procedure; it is not a universal Ryzen AI 9 HX 370 specification. Read TechRadar’s ASUS Zenbook S 16 testing.

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AnandTech’s independent review found the largest advantages in multi-threaded work. In the cited SPEC results, the HX 370 delivered approximately a 20% multi-threaded integer improvement over the Ryzen 9 7940HS. That is a more useful retrospective reference than treating one leaked Geekbench run as proof of a flat 20% gain in every application.

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CPU performance is not the same as AI performance

The Ryzen AI 9 HX 370 is also an AI-PC processor. Its NPU is rated by AMD at up to 50 TOPS for supported workloads, including Copilot+ PC-class features where the laptop and software meet Microsoft’s requirements.

However, NPU TOPS is a theoretical throughput figure, not a guarantee that every application will run faster. CPU performance, GPU performance, and NPU performance describe different parts of the chip. Buyers should check whether the applications they use actually support local NPU acceleration.

Radeon 890M: a strong iGPU, not a gaming-GPU replacement

The Radeon 890M can make a meaningful difference in a thin-and-light laptop. Fast dual-channel or soldered LPDDR5X memory is particularly important because the integrated GPU shares system memory with the CPU. A laptop with slower memory or conservative power tuning may perform substantially worse than another HX 370 system.

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Its practical target is generally 1080p gaming at reduced settings, with upscaling where necessary. It is not equivalent to a discrete GeForce RTX laptop GPU. In the Zenbook S 16, TechRadar’s selected 1080p game results were playable but modest, and frame rates fell as resolution and image-quality settings increased.

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Why every HX 370 laptop will not perform the same

AMD specifies a configurable 15–54 W range. The processor name therefore does not tell you the sustained performance of the finished laptop. Manufacturers can tune the same chip for thinness, low noise, battery life, or higher performance.

Important variables include:

  • Sustained package-power and short-term boost limits
  • Heat-pipe, vapor-chamber, and fan design
  • BIOS and firmware maturity
  • LPDDR5X speed and memory capacity
  • Windows power mode and OEM performance profiles
  • Whether the system is plugged in
  • Chassis thickness and ambient temperature
  • Display resolution and refresh rate

A 28 W ultrathin implementation should not be compared directly with a 54 W configuration or a 100 W-plus gaming CPU without labeling the power class. Short benchmark bursts can also look much better than sustained rendering after the system reaches thermal saturation.

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How it compares with other processors

Previous AMD mobile chips

The Ryzen 9 7940HS and 8945HS are the most relevant comparisons. The HX 370’s clearest advantage is generally multi-core throughput and integrated graphics. Its single-core performance is competitive, but the available evidence does not support claiming a universal single-core victory over every Intel, Apple, or AMD processor.

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Intel Core Ultra

AMD published comparisons against Intel Core Ultra processors using selected workloads and specific ASUS configurations. Those figures can show AMD’s intended competitive positioning, but they are vendor-controlled tests rather than neutral independent evidence. AMD’s comparison material should be read with its methodology and configuration details in mind.

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Apple silicon

Apple silicon is a legitimate alternative for buyers comfortable with macOS, especially those prioritizing battery life and quiet operation. But a single Geekbench number cannot settle an AMD-versus-Apple verdict. Operating system, application support, power draw, sustained performance, and gaming compatibility all matter.

High-wattage gaming CPUs

A high-wattage Ryzen HX or Intel gaming processor can still win sustained rendering and demanding gaming workloads when paired with stronger cooling and a discrete GPU. The HX 370’s advantage is the balance of performance, efficiency, portability, and integrated graphics—not automatic dominance over larger gaming systems.

Who should consider an HX 370 laptop?

The processor is especially attractive for buyers who want a premium thin-and-light system with strong parallel CPU performance, capable integrated graphics, and good performance per watt. It can suit developers, content creators working within moderate workloads, office users, and people who want to run demanding productivity applications without carrying a large gaming laptop.

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It is a poorer fit for buyers seeking maximum AAA gaming performance, workstation-class sustained rendering, or a replacement for a laptop with a high-power discrete GPU. Those buyers should compare complete systems with discrete Radeon or GeForce graphics and stronger cooling.

Potential products include the ASUS Zenbook S 16 as a portability-focused reference design, ASUS TUF Gaming systems where a discrete GPU and more substantial cooling matter, the Framework Laptop 13 for buyers prioritizing repairability and modularity, and HX 370 mini-PCs for compact desktop use. In every case, compare the exact GPU, memory, storage, display, power profile, cooling system, warranty, and current price. Historical review prices and reported mini-PC prices are not reliable current offers.

Bottom line

The Ryzen AI 9 HX 370 leak was promising early evidence of a strong mobile processor, not definitive proof that it would beat every rival in every workload. The final chip broadly delivered on the most important part of the story: unusually strong multi-core performance and integrated graphics for premium mobile systems. Its real-world result still depends on how each laptop manufacturer configures power, cooling, memory, and firmware.

Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon at the time of purchase will apply.

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